Nibble Mode DRAM, 4MX1, 80ns, CMOS, PDSO20
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | LAPIS Semiconductor Co., Ltd. |
package instruction | SOJ, SOJ20/26,.34 |
Reach Compliance Code | unknown |
Maximum access time | 80 ns |
I/O type | SEPARATE |
JESD-30 code | R-PDSO-J20 |
JESD-609 code | e0 |
memory density | 4194304 bit |
Memory IC Type | NIBBLE MODE DRAM |
memory width | 1 |
Number of terminals | 20 |
word count | 4194304 words |
character code | 4000000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 4MX1 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOJ |
Encapsulate equivalent code | SOJ20/26,.34 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
power supply | 5 V |
Certification status | Not Qualified |
refresh cycle | 1024 |
Maximum standby current | 0.001 A |
Maximum slew rate | 0.08 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
MSM514101A-80SJ | MSM514101AL-10SJ | MSM514101A-70SJ | MSM514101AL-80ZS | MSM514101AL-70SJ | MSM514101BL-60ZS | |
---|---|---|---|---|---|---|
Description | Nibble Mode DRAM, 4MX1, 80ns, CMOS, PDSO20 | Nibble Mode DRAM, 4MX1, 100ns, CMOS, PDSO20 | Nibble Mode DRAM, 4MX1, 70ns, CMOS, PDSO20 | Nibble Mode DRAM, 4MX1, 80ns, CMOS, PZIP20 | Nibble Mode DRAM, 4MX1, 70ns, CMOS, PDSO20 | Nibble Mode DRAM, 4MX1, 60ns, CMOS, PZIP20 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | SOJ, SOJ20/26,.34 | SOJ, SOJ20/26,.34 | SOJ, SOJ20/26,.34 | ZIP, ZIP20,.1 | SOJ, SOJ20/26,.34 | ZIP, ZIP20,.1 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
Maximum access time | 80 ns | 100 ns | 70 ns | 80 ns | 70 ns | 60 ns |
I/O type | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
JESD-30 code | R-PDSO-J20 | R-PDSO-J20 | R-PDSO-J20 | R-PZIP-T20 | R-PDSO-J20 | R-PZIP-T20 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
memory density | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bi |
Memory IC Type | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM | NIBBLE MODE DRAM |
memory width | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 |
word count | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
character code | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 4MX1 | 4MX1 | 4MX1 | 4MX1 | 4MX1 | 4MX1 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOJ | SOJ | SOJ | ZIP | SOJ | ZIP |
Encapsulate equivalent code | SOJ20/26,.34 | SOJ20/26,.34 | SOJ20/26,.34 | ZIP20,.1 | SOJ20/26,.34 | ZIP20,.1 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
refresh cycle | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 |
Maximum standby current | 0.001 A | 0.0002 A | 0.001 A | 0.0002 A | 0.0002 A | 0.0002 A |
Maximum slew rate | 0.08 mA | 0.07 mA | 0.09 mA | 0.08 mA | 0.09 mA | 0.1 mA |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES | NO | YES | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | J BEND | J BEND | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | ZIG-ZAG | DUAL | ZIG-ZAG |
Maker | LAPIS Semiconductor Co., Ltd. | - | LAPIS Semiconductor Co., Ltd. | LAPIS Semiconductor Co., Ltd. | LAPIS Semiconductor Co., Ltd. | LAPIS Semiconductor Co., Ltd. |