S29WS064J0SBFI03 datasheet, PDF

S29WS064J0SBFI03: DescriptionFlash, 4MX16, 45ns, PBGA80, 7 X 9 MM, LEAD FREE, FBGA-80; Categorystorage storage; File Size2MB，110 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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S29WS064J0SBFI03 Overview

Flash, 4MX16, 45ns, PBGA80, 7 X 9 MM, LEAD FREE, FBGA-80

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	BGA
package instruction	7 X 9 MM, LEAD FREE, FBGA-80
Contacts	80
Reach Compliance Code	compliant
ECCN code	3A991.B.1.A
Maximum access time	45 ns
Other features	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
JESD-30 code	R-PBGA-B80
JESD-609 code	e1
length	9 mm
memory density	67108864 bit
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of terminals	80
word count	4194304 words
character code	4000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	4MX16
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
Programming voltage	1.8 V
Certification status	Not Qualified
Maximum seat height	1 mm
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
type	NOR TYPE
width	7 mm

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