1 A, SILICON, SIGNAL DIODE
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Microsemi |
package instruction | HERMETIC SEALED, MINIATURE, GLASS, A PACKAGE-2 |
Reach Compliance Code | unknow |
ECCN code | EAR99 |
Other features | HIGH RELIABILITY |
Shell connection | ISOLATED |
Configuration | SINGLE |
Diode component materials | SILICON |
Diode type | RECTIFIER DIODE |
JESD-30 code | O-LALF-W2 |
JESD-609 code | e0 |
Number of components | 1 |
Number of terminals | 2 |
Maximum operating temperature | 175 °C |
Minimum operating temperature | -65 °C |
Maximum output current | 1 A |
Package body material | GLASS |
Package shape | ROUND |
Package form | LONG FORM |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Maximum repetitive peak reverse voltage | 200 V |
surface mount | NO |
technology | AVALANCHE |
Terminal surface | TIN LEAD |
Terminal form | WIRE |
Terminal location | AXIAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
UT234 | UT267 | UT258 | UT254 | UT242 | UT235 | |
---|---|---|---|---|---|---|
Description | 1 A, SILICON, SIGNAL DIODE | 2 A, SILICON, RECTIFIER DIODE | 1.5 A, SILICON, RECTIFIER DIODE | 1.5 A, SILICON, RECTIFIER DIODE | 1.25 A, SILICON, RECTIFIER DIODE | 1 A, SILICON, SIGNAL DIODE |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi |
Reach Compliance Code | unknow | unknow | unknow | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Diode type | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE |
Is it lead-free? | Contains lead | Contains lead | - | Contains lead | Contains lead | Contains lead |
Other features | HIGH RELIABILITY | HIGH RELIABILITY | - | HIGH RELIABILITY | HIGH RELIABILITY | HIGH RELIABILITY |
Shell connection | ISOLATED | ISOLATED | - | ISOLATED | ISOLATED | ISOLATED |
Configuration | SINGLE | SINGLE | - | SINGLE | SINGLE | SINGLE |
Diode component materials | SILICON | SILICON | - | SILICON | SILICON | SILICON |
JESD-30 code | O-LALF-W2 | O-LALF-W2 | - | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 |
JESD-609 code | e0 | e0 | - | e0 | e0 | e0 |
Number of components | 1 | 1 | - | 1 | 1 | 1 |
Number of terminals | 2 | 2 | - | 2 | 2 | 2 |
Package body material | GLASS | GLASS | - | GLASS | GLASS | GLASS |
Package shape | ROUND | ROUND | - | ROUND | ROUND | ROUND |
Package form | LONG FORM | LONG FORM | - | LONG FORM | LONG FORM | LONG FORM |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Certification status | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
surface mount | NO | NO | - | NO | NO | NO |
technology | AVALANCHE | AVALANCHE | - | AVALANCHE | AVALANCHE | AVALANCHE |
Terminal surface | TIN LEAD | TIN LEAD | - | TIN LEAD | TIN LEAD | TIN LEAD |
Terminal form | WIRE | WIRE | - | WIRE | WIRE | WIRE |
Terminal location | AXIAL | AXIAL | - | AXIAL | AXIAL | AXIAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |