1.5 A, SILICON, RECTIFIER DIODE
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Microsemi |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Other features | HIGH RELIABILITY |
| Shell connection | ISOLATED |
| Configuration | SINGLE |
| Diode component materials | SILICON |
| Diode type | RECTIFIER DIODE |
| JESD-30 code | O-LALF-W2 |
| JESD-609 code | e0 |
| Number of components | 1 |
| Number of terminals | 2 |
| Package body material | GLASS |
| Package shape | ROUND |
| Package form | LONG FORM |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | AVALANCHE |
| Terminal surface | TIN LEAD |
| Terminal form | WIRE |
| Terminal location | AXIAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| UT254 | UT267 | UT258 | UT242 | UT235 | UT234 | |
|---|---|---|---|---|---|---|
| Description | 1.5 A, SILICON, RECTIFIER DIODE | 2 A, SILICON, RECTIFIER DIODE | 1.5 A, SILICON, RECTIFIER DIODE | 1.25 A, SILICON, RECTIFIER DIODE | 1 A, SILICON, SIGNAL DIODE | 1 A, SILICON, SIGNAL DIODE |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi |
| Reach Compliance Code | unknown | unknow | unknow | unknown | unknown | unknow |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Diode type | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE | RECTIFIER DIODE |
| Is it lead-free? | Contains lead | Contains lead | - | Contains lead | Contains lead | Contains lead |
| Other features | HIGH RELIABILITY | HIGH RELIABILITY | - | HIGH RELIABILITY | HIGH RELIABILITY | HIGH RELIABILITY |
| Shell connection | ISOLATED | ISOLATED | - | ISOLATED | ISOLATED | ISOLATED |
| Configuration | SINGLE | SINGLE | - | SINGLE | SINGLE | SINGLE |
| Diode component materials | SILICON | SILICON | - | SILICON | SILICON | SILICON |
| JESD-30 code | O-LALF-W2 | O-LALF-W2 | - | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 |
| JESD-609 code | e0 | e0 | - | e0 | e0 | e0 |
| Number of components | 1 | 1 | - | 1 | 1 | 1 |
| Number of terminals | 2 | 2 | - | 2 | 2 | 2 |
| Package body material | GLASS | GLASS | - | GLASS | GLASS | GLASS |
| Package shape | ROUND | ROUND | - | ROUND | ROUND | ROUND |
| Package form | LONG FORM | LONG FORM | - | LONG FORM | LONG FORM | LONG FORM |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | NO | - | NO | NO | NO |
| technology | AVALANCHE | AVALANCHE | - | AVALANCHE | AVALANCHE | AVALANCHE |
| Terminal surface | TIN LEAD | TIN LEAD | - | TIN LEAD | TIN LEAD | TIN LEAD |
| Terminal form | WIRE | WIRE | - | WIRE | WIRE | WIRE |
| Terminal location | AXIAL | AXIAL | - | AXIAL | AXIAL | AXIAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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