MR1A16AMA35R datasheet, PDF - EEWORLD Datasheet

MR1A16AMA35R: DescriptionMemory Circuit,; Categorystorage storage; File Size1MB，20 Pages; ManufacturerEverspin Technologies; Environmental Compliance

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Memory Circuit,

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Everspin Technologies
package instruction	BGA-48
Reach Compliance Code	compliant
JESD-30 code	S-PBGA-B48
length	8 mm
memory density	2097152 bit
Memory IC Type	MEMORY CIRCUIT
memory width	16
Number of functions	1
Number of terminals	48
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX16
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Maximum seat height	1.35 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
width	8 mm

	MR1A16AMA35R	MR1A16ACMA35R	MR1A16AVMA35R
Description	Memory Circuit,	Memory Circuit,	Memory Circuit,
Is it Rohs certified?	conform to	conform to	conform to
package instruction	BGA-48	LFBGA,	LFBGA,
Reach Compliance Code	compliant	unknown	unknown
JESD-30 code	S-PBGA-B48	S-PBGA-B48	S-PBGA-B48
length	8 mm	8 mm	8 mm
memory density	2097152 bit	2097152 bit	2097152 bit
Memory IC Type	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
memory width	16	16	16
Number of functions	1	1	1
Number of terminals	48	48	48
word count	131072 words	131072 words	131072 words
character code	128000	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	85 °C	105 °C
Minimum operating temperature	-	-40 °C	-40 °C
organize	128KX16	128KX16	128KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFBGA	LFBGA
Package shape	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Maximum seat height	1.35 mm	1.35 mm	1.35 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL	BALL
Terminal pitch	0.75 mm	0.75 mm	0.75 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM
width	8 mm	8 mm	8 mm
Maker	Everspin Technologies	-	Everspin Technologies

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