Memory Circuit,
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Everspin Technologies |
package instruction | LFBGA, |
Reach Compliance Code | unknown |
JESD-30 code | S-PBGA-B48 |
length | 8 mm |
memory density | 2097152 bit |
Memory IC Type | MEMORY CIRCUIT |
memory width | 16 |
Number of functions | 1 |
Number of terminals | 48 |
word count | 131072 words |
character code | 128000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 105 °C |
Minimum operating temperature | -40 °C |
organize | 128KX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFBGA |
Package shape | SQUARE |
Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
Maximum seat height | 1.35 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | BALL |
Terminal pitch | 0.75 mm |
Terminal location | BOTTOM |
width | 8 mm |
MR1A16AVMA35R | MR1A16ACMA35R | MR1A16AMA35R | |
---|---|---|---|
Description | Memory Circuit, | Memory Circuit, | Memory Circuit, |
Is it Rohs certified? | conform to | conform to | conform to |
package instruction | LFBGA, | LFBGA, | BGA-48 |
Reach Compliance Code | unknown | unknown | compliant |
JESD-30 code | S-PBGA-B48 | S-PBGA-B48 | S-PBGA-B48 |
length | 8 mm | 8 mm | 8 mm |
memory density | 2097152 bit | 2097152 bit | 2097152 bit |
Memory IC Type | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT |
memory width | 16 | 16 | 16 |
Number of functions | 1 | 1 | 1 |
Number of terminals | 48 | 48 | 48 |
word count | 131072 words | 131072 words | 131072 words |
character code | 128000 | 128000 | 128000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 105 °C | 85 °C | 70 °C |
Minimum operating temperature | -40 °C | -40 °C | - |
organize | 128KX16 | 128KX16 | 128KX16 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | LFBGA | LFBGA | LFBGA |
Package shape | SQUARE | SQUARE | SQUARE |
Package form | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
Maximum seat height | 1.35 mm | 1.35 mm | 1.35 mm |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES |
technology | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
Terminal form | BALL | BALL | BALL |
Terminal pitch | 0.75 mm | 0.75 mm | 0.75 mm |
Terminal location | BOTTOM | BOTTOM | BOTTOM |
width | 8 mm | 8 mm | 8 mm |
Maker | Everspin Technologies | - | Everspin Technologies |