MCM64Z916ZP11 datasheet, PDF - EEWORLD Datasheet

MCM64Z916ZP11: Description512KX18 ZBT SRAM, 11ns, PBGA119, PLASTIC, BGA-119; Categorystorage storage; File Size738KB，34 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MCM64Z916ZP11 Overview

512KX18 ZBT SRAM, 11ns, PBGA119, PLASTIC, BGA-119

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	NXP
Parts packaging code	BGA
package instruction	PLASTIC, BGA-119
Contacts	119
Reach Compliance Code	compliant
ECCN code	3A991.B.2.A
Maximum access time	11 ns
Other features	FLOW-THROUGH OR PIPELINED ARCHTECTURE
I/O type	COMMON
JESD-30 code	R-PBGA-B119
length	22 mm
memory density	9437184 bit
Memory IC Type	ZBT SRAM
memory width	18
Humidity sensitivity level	1
Number of functions	1
Number of terminals	119
word count	524288 words
character code	512000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX18
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA119,7X17,50
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	2.5 V
Certification status	Not Qualified
Maximum seat height	2.4 mm
Maximum standby current	0.01 A
Minimum standby current	2.3 V
Maximum supply voltage (Vsup)	2.7 V
Minimum supply voltage (Vsup)	2.3 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm

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