4M X 16 FLASH 3V PROM, 120 ns, PBGA64
Parameter Name | Attribute value |
Number of functions | 1 |
Number of terminals | 64 |
Minimum operating temperature | -40 Cel |
Maximum operating temperature | 85 Cel |
Rated supply voltage | 3.3 V |
Minimum supply/operating voltage | 3 V |
Maximum supply/operating voltage | 3.6 V |
Processing package description | 13 X 11 MM, 1 MM PITCH, FBGA-64 |
state | Transferred |
ype | NOR TYPE |
sub_category | Flash Memories |
ccess_time_max | 120 ns |
command_user_interface | YES |
common_flash_interface | YES |
data_polling | YES |
jesd_30_code | R-PBGA-B64 |
storage density | 6.71E7 bi |
Memory IC type | FLASH |
umber_of_sectors_size | 128 |
Number of digits | 4.19E6 words |
Number of digits | 4M |
operating mode | ASYNCHRONOUS |
organize | 4MX16 |
Packaging Materials | PLASTIC/EPOXY |
ckage_code | LBGA |
ckage_equivalence_code | BGA64,8X8,40 |
packaging shape | RECTANGULAR |
Package Size | GRID ARRAY, LOW PROFILE |
serial parallel | PARALLEL |
wer_supplies__v_ | 3.3,3/5 |
gramming_voltage__v_ | 3 |
qualification_status | COMMERCIAL |
eady_busy | YES |
seated_height_max | 1.4 mm |
sector_size__words_ | 32K |
standby_current_max | 5.00E-6 Am |
Maximum supply voltage | 0.0300 Am |
surface mount | YES |
Craftsmanship | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | BALL |
Terminal spacing | 1 mm |
Terminal location | BOTTOM |
ggle_bi | YES |
length | 13 mm |
width | 11 mm |