DAC7801D datasheet, PDF - EEWORLD Datasheet

DAC7801D: DescriptionD/A Converter, 2 Func, Parallel, 8 Bits Input Loading, 0.4us Settling Time,; CategoryAnalog mixed-signal IC converter; File Size501KB，13 Pages; ManufacturerBurr-Brown; Websitehttp://www.burr-brown.com/

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DAC7801D Overview

D/A Converter, 2 Func, Parallel, 8 Bits Input Loading, 0.4us Settling Time,

Parameter Name	Attribute value
Maker	Burr-Brown
package instruction	DIE, DIE OR CHIP
Reach Compliance Code	unknown
Converter type	D/A CONVERTER
Enter bit code	BINARY, OFFSET BINARY
Input format	PARALLEL, 8 BITS
JESD-30 code	X-XUUC-N27
Maximum linear error (EL)	0.024%
Number of digits	12
Number of functions	2
Number of terminals	27
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	UNSPECIFIED
encapsulated code	DIE
Encapsulate equivalent code	DIE OR CHIP
Package shape	UNSPECIFIED
Package form	UNCASED CHIP
power supply	5 V
Certification status	Not Qualified
Maximum stabilization time	1 µs
Nominal settling time (tstl)	0.4 µs
Maximum slew rate	2 mA
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	NO LEAD
Terminal location	UPPER

	DAC7801D	DAC7800D	DAC7802D
Description	D/A Converter, 2 Func, Parallel, 8 Bits Input Loading, 0.4us Settling Time,	D/A Converter, 2 Func, Serial Input Loading, 0.4us Settling Time,	D/A Converter, 2 Func, Parallel, Word Input Loading, 0.4us Settling Time,
Maker	Burr-Brown	Burr-Brown	Burr-Brown
package instruction	DIE, DIE OR CHIP	DIE, DIE OR CHIP	DIE, DIE OR CHIP
Reach Compliance Code	unknown	unknown	unknown
Converter type	D/A CONVERTER	D/A CONVERTER	D/A CONVERTER
Enter bit code	BINARY, OFFSET BINARY	BINARY, OFFSET BINARY	BINARY, OFFSET BINARY
Input format	PARALLEL, 8 BITS	SERIAL	PARALLEL, WORD
JESD-30 code	X-XUUC-N27	X-XUUC-N19	X-XUUC-N27
Maximum linear error (EL)	0.024%	0.024%	0.024%
Number of digits	12	12	12
Number of functions	2	2	2
Number of terminals	27	19	27
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIE	DIE	DIE
Encapsulate equivalent code	DIE OR CHIP	DIE OR CHIP	DIE OR CHIP
Package shape	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Package form	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP
power supply	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum stabilization time	1 µs	1 µs	1 µs
Nominal settling time (tstl)	0.4 µs	0.4 µs	0.4 µs
Maximum slew rate	2 mA	2 mA	2 mA
Nominal supply voltage	5 V	5 V	5 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	NO LEAD	NO LEAD	NO LEAD
Terminal location	UPPER	UPPER	UPPER

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

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