D/A Converter, 2 Func, Parallel, Word Input Loading, 0.4us Settling Time,
Parameter Name | Attribute value |
Maker | Burr-Brown |
package instruction | DIE, DIE OR CHIP |
Reach Compliance Code | unknown |
Converter type | D/A CONVERTER |
Enter bit code | BINARY, OFFSET BINARY |
Input format | PARALLEL, WORD |
JESD-30 code | X-XUUC-N27 |
Maximum linear error (EL) | 0.024% |
Number of digits | 12 |
Number of functions | 2 |
Number of terminals | 27 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | UNSPECIFIED |
encapsulated code | DIE |
Encapsulate equivalent code | DIE OR CHIP |
Package shape | UNSPECIFIED |
Package form | UNCASED CHIP |
power supply | 5 V |
Certification status | Not Qualified |
Maximum stabilization time | 1 µs |
Nominal settling time (tstl) | 0.4 µs |
Maximum slew rate | 2 mA |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | NO LEAD |
Terminal location | UPPER |
DAC7802D | DAC7800D | DAC7801D | |
---|---|---|---|
Description | D/A Converter, 2 Func, Parallel, Word Input Loading, 0.4us Settling Time, | D/A Converter, 2 Func, Serial Input Loading, 0.4us Settling Time, | D/A Converter, 2 Func, Parallel, 8 Bits Input Loading, 0.4us Settling Time, |
Maker | Burr-Brown | Burr-Brown | Burr-Brown |
package instruction | DIE, DIE OR CHIP | DIE, DIE OR CHIP | DIE, DIE OR CHIP |
Reach Compliance Code | unknown | unknown | unknown |
Converter type | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
Enter bit code | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY |
Input format | PARALLEL, WORD | SERIAL | PARALLEL, 8 BITS |
JESD-30 code | X-XUUC-N27 | X-XUUC-N19 | X-XUUC-N27 |
Maximum linear error (EL) | 0.024% | 0.024% | 0.024% |
Number of digits | 12 | 12 | 12 |
Number of functions | 2 | 2 | 2 |
Number of terminals | 27 | 19 | 27 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
encapsulated code | DIE | DIE | DIE |
Encapsulate equivalent code | DIE OR CHIP | DIE OR CHIP | DIE OR CHIP |
Package shape | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
Package form | UNCASED CHIP | UNCASED CHIP | UNCASED CHIP |
power supply | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified |
Maximum stabilization time | 1 µs | 1 µs | 1 µs |
Nominal settling time (tstl) | 0.4 µs | 0.4 µs | 0.4 µs |
Maximum slew rate | 2 mA | 2 mA | 2 mA |
Nominal supply voltage | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES |
technology | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | NO LEAD | NO LEAD | NO LEAD |
Terminal location | UPPER | UPPER | UPPER |