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DAC7802D

Description
D/A Converter, 2 Func, Parallel, Word Input Loading, 0.4us Settling Time,
CategoryAnalog mixed-signal IC    converter   
File Size501KB,13 Pages
ManufacturerBurr-Brown
Websitehttp://www.burr-brown.com/
Download Datasheet Parametric Compare View All

DAC7802D Overview

D/A Converter, 2 Func, Parallel, Word Input Loading, 0.4us Settling Time,

DAC7802D Parametric

Parameter NameAttribute value
MakerBurr-Brown
package instructionDIE, DIE OR CHIP
Reach Compliance Codeunknown
Converter typeD/A CONVERTER
Enter bit codeBINARY, OFFSET BINARY
Input formatPARALLEL, WORD
JESD-30 codeX-XUUC-N27
Maximum linear error (EL)0.024%
Number of digits12
Number of functions2
Number of terminals27
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialUNSPECIFIED
encapsulated codeDIE
Encapsulate equivalent codeDIE OR CHIP
Package shapeUNSPECIFIED
Package formUNCASED CHIP
power supply5 V
Certification statusNot Qualified
Maximum stabilization time1 µs
Nominal settling time (tstl)0.4 µs
Maximum slew rate2 mA
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formNO LEAD
Terminal locationUPPER

DAC7802D Related Products

DAC7802D DAC7800D DAC7801D
Description D/A Converter, 2 Func, Parallel, Word Input Loading, 0.4us Settling Time, D/A Converter, 2 Func, Serial Input Loading, 0.4us Settling Time, D/A Converter, 2 Func, Parallel, 8 Bits Input Loading, 0.4us Settling Time,
Maker Burr-Brown Burr-Brown Burr-Brown
package instruction DIE, DIE OR CHIP DIE, DIE OR CHIP DIE, DIE OR CHIP
Reach Compliance Code unknown unknown unknown
Converter type D/A CONVERTER D/A CONVERTER D/A CONVERTER
Enter bit code BINARY, OFFSET BINARY BINARY, OFFSET BINARY BINARY, OFFSET BINARY
Input format PARALLEL, WORD SERIAL PARALLEL, 8 BITS
JESD-30 code X-XUUC-N27 X-XUUC-N19 X-XUUC-N27
Maximum linear error (EL) 0.024% 0.024% 0.024%
Number of digits 12 12 12
Number of functions 2 2 2
Number of terminals 27 19 27
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code DIE DIE DIE
Encapsulate equivalent code DIE OR CHIP DIE OR CHIP DIE OR CHIP
Package shape UNSPECIFIED UNSPECIFIED UNSPECIFIED
Package form UNCASED CHIP UNCASED CHIP UNCASED CHIP
power supply 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum stabilization time 1 µs 1 µs 1 µs
Nominal settling time (tstl) 0.4 µs 0.4 µs 0.4 µs
Maximum slew rate 2 mA 2 mA 2 mA
Nominal supply voltage 5 V 5 V 5 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form NO LEAD NO LEAD NO LEAD
Terminal location UPPER UPPER UPPER
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