Standard SRAM, 8KX8, 8ns, CMOS, CDIP28, 0.300 INCH, ROHS COMPLIANT, CERAMIC, DIP-28
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Pyramid Semiconductor Corporation |
Parts packaging code | DIP |
package instruction | 0.300 INCH, ROHS COMPLIANT, CERAMIC, DIP-28 |
Contacts | 28 |
Reach Compliance Code | compliant |
ECCN code | 3A001.A.2.C |
Maximum access time | 8 ns |
JESD-30 code | R-CDIP-T28 |
memory density | 65536 bit |
Memory IC Type | STANDARD SRAM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 28 |
word count | 8192 words |
character code | 8000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 8KX8 |
Package body material | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Maximum seat height | 5.715 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 7.62 mm |