AT27LV512R-25KI datasheet, PDF

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AT27LV512R-25KI: DescriptionUVPROM, 64KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32; Categorystorage storage; File Size233KB，8 Pages; ManufacturerAtmel (Microchip)

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AT27LV512R-25KI Overview

UVPROM, 64KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32

AT27LV512R-25KI Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Atmel (Microchip)
Parts packaging code	QFJ
package instruction	WQCCJ, LDCC32,.5X.6
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	250 ns
I/O type	COMMON
JESD-30 code	R-CQCC-J32
JESD-609 code	e0
length	14.1 mm
memory density	524288 bit
Memory IC Type	UVPROM
memory width	8
Humidity sensitivity level	2
Number of functions	1
Number of terminals	32
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	64KX8
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	WQCCJ
Encapsulate equivalent code	LDCC32,.5X.6
Package shape	RECTANGULAR
Package form	CHIP CARRIER, WINDOW
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	3.3/5 V
Certification status	Not Qualified
Maximum seat height	4.24 mm
Maximum standby current	0.0001 A
Maximum slew rate	0.025 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	11.55 mm

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AT27LV512R-25KI Related Products

	AT27LV512R-25KI	AT27LV512R-20KC	AT27LV512R-20KI	AT27LV512R-25KC
Description	UVPROM, 64KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32	UVPROM, 64KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32	UVPROM, 64KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32	UVPROM, 64KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)	Atmel (Microchip)
Parts packaging code	QFJ	QFJ	QFJ	QFJ
package instruction	WQCCJ, LDCC32,.5X.6	WQCCJ, LDCC32,.5X.6	WQCCJ, LDCC32,.5X.6	WQCCJ, LDCC32,.5X.6
Contacts	32	32	32	32
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99
Maximum access time	250 ns	200 ns	200 ns	250 ns
I/O type	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-CQCC-J32	R-CQCC-J32	R-CQCC-J32	R-CQCC-J32
JESD-609 code	e0	e0	e0	e0
length	14.1 mm	14.1 mm	14.1 mm	14.1 mm
memory density	524288 bit	524288 bit	524288 bit	524288 bit
Memory IC Type	UVPROM	UVPROM	UVPROM	UVPROM
memory width	8	8	8	8
Humidity sensitivity level	2	2	2	2
Number of functions	1	1	1	1
Number of terminals	32	32	32	32
word count	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	85 °C	70 °C
organize	64KX8	64KX8	64KX8	64KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	WQCCJ	WQCCJ	WQCCJ	WQCCJ
Encapsulate equivalent code	LDCC32,.5X.6	LDCC32,.5X.6	LDCC32,.5X.6	LDCC32,.5X.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	225	225	225	225
power supply	3.3/5 V	3.3/5 V	3.3/5 V	3.3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.24 mm	4.24 mm	4.24 mm	4.24 mm
Maximum standby current	0.0001 A	0.0001 A	0.0001 A	0.0001 A
Maximum slew rate	0.025 mA	0.02 mA	0.025 mA	0.02 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	J BEND	J BEND	J BEND
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	11.55 mm	11.55 mm	11.55 mm	11.55 mm

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