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IXFN66N50Q2

Description
Power Field-Effect Transistor, 66A I(D), 500V, 0.08ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, MINIBLOC-4
CategoryDiscrete semiconductor    The transistor   
File Size150KB,5 Pages
ManufacturerIXYS
Environmental Compliance
Download Datasheet Parametric View All

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IXFN66N50Q2 Overview

Power Field-Effect Transistor, 66A I(D), 500V, 0.08ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, MINIBLOC-4

IXFN66N50Q2 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerIXYS
package instructionFLANGE MOUNT, R-XUFM-X4
Contacts4
Reach Compliance Codecompliant
Other featuresAVALANCHE RATED, UL RECOGNIZED
Avalanche Energy Efficiency Rating (Eas)4000 mJ
Shell connectionISOLATED
ConfigurationSINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage500 V
Maximum drain current (Abs) (ID)66 A
Maximum drain current (ID)66 A
Maximum drain-source on-resistance0.08 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JESD-30 codeR-XUFM-X4
Number of components1
Number of terminals4
Operating modeENHANCEMENT MODE
Maximum operating temperature150 °C
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeN-CHANNEL
Maximum power dissipation(Abs)735 W
Maximum pulsed drain current (IDM)264 A
Certification statusNot Qualified
surface mountNO
Terminal surfaceNickel (Ni)
Terminal formUNSPECIFIED
Terminal locationUPPER
Maximum time at peak reflow temperatureNOT SPECIFIED
transistor applicationsSWITCHING
Transistor component materialsSILICON

IXFN66N50Q2 Preview

HiPerFET
TM
Power MOSFET
IXFN66N50Q2
N-Channel Enhancement Mode
Avalanche Rated, Low Q
g
, Low Intrinsic R
g
High dV/dt, Low t
rr
V
DSS
= 500 V
I
D25
= 66 A
R
DS(on)
= 80 mΩ
t
rr
250 ns
miniBLOC, SOT-227 B (IXFN)
E153432
Symbol
V
DSS
V
DGR
V
GS
V
GSM
I
D25
I
DM
I
AR
E
AR
E
AS
dv/dt
P
D
T
J
T
JM
T
stg
V
ISOL
M
d
Weight
50/60 Hz, RMS, t = 1 minute
Mounting torque
Terminal connection torque
Test Conditions
T
J
= 25°C to 150°C
T
J
= 25°C to 150°C; R
GS
= 1 MΩ
Continuous
Transient
T
C
= 25°C
T
C
= 25°C, pulse width limited by T
JM
T
C
= 25°C
T
C
= 25°C
T
C
= 25°C
I
S
I
DM
, di/dt
100 A/µs, V
DD
V
DSS
T
J
150°C, R
G
= 2
T
C
= 25°C
Maximum Ratings
G
S
500
500
±30
±40
66
264
66
75
4.0
20
735
-55 ... +150
150
-55 ... +150
2500
V
V
V
V
A
A
A
mJ
J
V/ns
W
°C
°C
°C
V
Features
l
Double metal process for low
gate resistance
miniBLOC, with Aluminium nitride
isolation
Unclamped Inductive Switching (UIS)
rated
Low package inductance
Fast intrinsic Rectifier
Applications
DC-DC converters
Switched-mode and resonant-mode
power supplies
DC choppers
Pulse generators
Advantages
Easy to mount
Space savings
High power density
G = Gate
S = Source
S
D
D = Drain
Either Source terminal at miniBLOC can be used
as Main or Kelvin Source
1.5/13 Nm/lb.in.
1.5/13 Nm/lb.in.
30
g
Symbol
Test Conditions
Characteristic Values
(T
J
= 25°C, unless otherwise specified)
min. typ. max.
500
2.0
4.5
V
V
V
DSS
V
GS(th)
I
GSS
I
DSS
R
DS(on)
V
GS
= 0 V, I
D
= 3mA
V
DS
= V
GS
, I
D
= 8mA
V
GS
=
±30
V, V
DS
= 0
V
DS
= V
DSS
V
GS
= 0 V
V
GS
= 10 V, I
D
= 0.5 ï I
D25
T
J
= 25°C
T
J
= 125°C
±200
nA
50
µA
3 mA
80 mΩ
DS99077A(08/05)
© 2003 IXYS All rights reserved
IXFN66N50Q2
Symbol
Test Conditions
Characteristic Values
(T
J
= 25°C, unless otherwise specified)
min. typ. max.
Note 1
30
44
6800
V
GS
= 0 V, V
DS
= 25 V, f = 1 MHz
1200
270
32
V
GS
= 10 V, V
DS
= 0.5 ï V
DSS
, I
D
= 0.5 ï I
D25
R
G
= 1
(External)
16
60
12
199
V
GS
= 10 V, V
DS
= 0.5 ï V
DSS
, I
D
= 0.5 ï I
D25
42
92
0.17
0.05
S
pF
pF
pF
ns
ns
ns
ns
nC
nC
nC
K/W
K/W
M4 screws (4x) supplied
Dim.
A
B
C
D
E
F
G
H
J
K
L
M
N
O
Millimeter
Min.
Max.
31.50
7.80
4.09
4.09
4.09
14.91
30.12
38.00
11.68
8.92
0.76
12.60
25.15
1.98
4.95
26.54
3.94
4.72
24.59
-0.05
31.88
8.20
4.29
4.29
4.29
15.11
30.30
38.23
12.22
9.60
0.84
12.85
25.42
2.13
5.97
26.90
4.42
4.85
25.07
0.1
Inches
Min.
Max.
1.240
0.307
0.161
0.161
0.161
0.587
1.186
1.496
0.460
0.351
0.030
0.496
0.990
0.078
0.195
1.045
0.155
0.186
0.968
-0.002
1.255
0.323
0.169
0.169
0.169
0.595
1.193
1.505
0.481
0.378
0.033
0.506
1.001
0.084
0.235
1.059
0.174
0.191
0.987
0.004
miniBLOC, SOT-227 B Outline
g
fs
C
iss
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
Q
G(on)
Q
GS
Q
GD
R
thJC
R
thCK
V
DS
= 10 V; I
D
= 0.5 ï I
D25
Source-Drain Diode
Symbol
I
S
I
SM
V
SD
t
rr
Q
RM
I
RM
Test Conditions
V
GS
= 0 V
Repetitive;
pulse width limited by T
JM
I
F
= I
S
, V
GS
= 0 V, Note 1
I
F
= 25A
-di/dt = 100 A/µs
V
R
= 100 V
Characteristic Values
(T
J
= 25°C, unless otherwise specified)
min. typ. max.
66
264
1.5
250
1.0
10
A
A
V
ns
µC
A
P
Q
R
S
T
U
Note: 1. Pulse test, t
300
µs,
duty cycle d
2 %
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered by 4,835,592
one or moreof the following U.S. patents: 4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1
6,534,343
6,583,505
6,683,344
6,710,405B2
6,710,463
6,727,585
6,759,692
6771478 B2
IXFN66N50Q2
Fig. 1. Output Characteristics
@ 25
º
C
70
V
GS
= 10V
60
50
8V
7V
140
6V
120
160
V
GS
= 10V
9V
8V
Fig. 2. Extended Output Characteristics
@ 25
º
C
I
D
- Amperes
I
D
- Amperes
100
7V
80
60
40
20
0
5V
6V
40
30
20
10
0
0
1
2
3
4
5
6
7
5.5V
5V
4.5V
0
2
4
6
8
1
0
1
2
1
4
1
6
1
8
20
V
D S
- Volts
Fig. 3. Output Characteristics
@ 125
º
C
70
V
GS
= 10V
60
50
8V
7V
6V
5.5V
5V
3.1
2.8
V
GS
= 10V
V
D S
- Volts
Fig. 4. R
DS(on
)
Norm alized to 0.5 I
D25
Value vs. Junction Tem perature
R
D S ( o n )
- Normalized
2.5
2.2
1.9
1.6
1.3
1
0.7
I
D
= 66A
I
D
= 33A
I
D
- Amperes
40
30
20
10
4.5V
3.5V
0
0
2
4
6
8
10
12
14
0.4
-50
-25
0
25
50
75
100
125
150
V
D S
- Volts
Fig. 5. R
DS(on)
Norm alized to
0.5 I
D25
Value vs. I
D
3
2.8
2.6
V
GS
= 10V
T
J
= 125∫C
70
60
50
T
J
- Degrees Centigrade
Fig. 6. Drain Current vs. Case
Tem perature
R
D S ( o n )
- Normalized
2.4
2.2
2
1.8
1.6
1.4
1.2
1
0.8
0
20
40
60
80
I
D
- Amperes
T
J
= 25∫C
100
120
140
160
40
30
20
10
0
-50
-25
0
25
50
75
100
125
150
I
D
- Amperes
T
C
- Degrees Centigrade
© 2003 IXYS All rights reserved
IXFN66N50Q2
Fig. 7. Input Adm ittance
100
90
80
60
80
70
T
J
= -40∫C
25∫C
125∫C
Fig. 8. Transconductance
g
f s
- Siemens
I
D
- Amperes
70
60
50
40
30
20
10
0
3
3.5
4
4.5
5
5.5
6
6.5
7
T
J
= 125∫C
25∫C
-40∫C
50
40
30
20
10
0
0
20
40
60
80
100
120
V
G S
- Volts
Fig. 9. Source Current vs.
Source-To-Drain Voltage
180
160
140
10
9
8
7
V
DS
= 250V
I
D
= 33A
I
G
= 10mA
I
D
- Amperes
Fig. 10. Gate Charge
I
S
- Amperes
120
V
G S
- Volts
T
J
= 125∫C
T
J
= 25∫C
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
100
80
60
40
20
0
6
5
4
3
2
1
0
0
20
40
60
80
100 120 140 160 180 200
V
S D
- Volts
Fig. 11. Capacitance
10000
C iss
1000
Q
G
- nanoCoulombs
Fig. 12. Forw ard-Bias
Safe Operating Area
Capacitance - picoFarads
R
DS(on)
Limit
I
D
- Amperes
100
25µs
100µs
1ms
1000
C oss
10
T
J
= 150∫C
T
C
= 25∫C
1
0
5
10
15
20
25
30
35
40
10
100
DC
10ms
f = 1MHz
100
C rss
1000
V
D S
- Volts
IXYS reserves the right to change limits, test conditions, and dimensions.
V
D S
- Volts
IXFN66N50Q2
Fig. 13. Maxim um Transient Therm al Resistance
1.00
R
( t h ) J C
-
C / W
0.10
0.01
0.00
0.1
1
10
100
1000
10000
Pulse Width - milliseconds
© 2003 IXYS All rights reserved
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