ALS SERIES, 8-INPUT NAND GATE, CDIP14
| Parameter Name | Attribute value |
| Maker | Texas Instruments |
| package instruction | DIP, |
| Reach Compliance Code | unknown |
| series | ALS |
| JESD-30 code | R-GDIP-T14 |
| length | 19.56 mm |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | NAND GATE |
| Number of functions | 1 |
| Number of entries | 8 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Maximum supply current (ICC) | 0.9 mA |
| propagation delay (tpd) | 22 ns |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |
| SN54ALS30J-00 | SN74ALS30FN-00 | SN74ALS30N-10 | SN54ALS30FH-00 | |
|---|---|---|---|---|
| Description | ALS SERIES, 8-INPUT NAND GATE, CDIP14 | ALS SERIES, 8-INPUT NAND GATE, PQCC20 | ALS SERIES, 8-INPUT NAND GATE, PDIP14 | ALS SERIES, 8-INPUT NAND GATE, CQCC20 |
| package instruction | DIP, | QCCJ, | DIP, | QCCN, |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| series | ALS | ALS | ALS | ALS |
| JESD-30 code | R-GDIP-T14 | S-PQCC-J20 | R-PDIP-T14 | S-CQCC-N20 |
| length | 19.56 mm | 8.9662 mm | 19.305 mm | 8.89 mm |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of entries | 8 | 8 | 8 | 8 |
| Number of terminals | 14 | 20 | 14 | 20 |
| Maximum operating temperature | 125 °C | 70 °C | 70 °C | 125 °C |
| Package body material | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP | QCCJ | DIP | QCCN |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| Package form | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER |
| Maximum supply current (ICC) | 0.9 mA | 0.9 mA | 0.9 mA | 0.9 mA |
| propagation delay (tpd) | 22 ns | 20 ns | 20 ns | 22 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 4.57 mm | 5.08 mm | 2.54 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | NO | YES |
| technology | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY |
| Terminal form | THROUGH-HOLE | J BEND | THROUGH-HOLE | NO LEAD |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | DUAL | QUAD |
| width | 7.62 mm | 8.9662 mm | 7.62 mm | 8.89 mm |
| Maker | Texas Instruments | - | Texas Instruments | Texas Instruments |
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