D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, MQCC20,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Monolithic Memories |
| package instruction | QCCN, LCC20,.35SQ |
| Reach Compliance Code | unknown |
| JESD-30 code | S-MQCC-N20 |
| JESD-609 code | e0 |
| Logic integrated circuit type | D FLIP-FLOP |
| Number of functions | 8 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | METAL |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC20,.35SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| surface mount | YES |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Trigger type | POSITIVE EDGE |
| SN54S383L | SN54S383L883B | SN54S383J | SN54S383J883B | SN74S383J | SN74S383N | SN54S383W | SN54S383W883B | |
|---|---|---|---|---|---|---|---|---|
| Description | D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, MQCC20, | D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, MQCC20, | D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, CDIP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, CDIP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, CDIP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, PDIP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, CDFP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, CDFP20, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | QCCN, LCC20,.35SQ | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DFP, FL20,.3 | DFP, FL20,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | S-MQCC-N20 | S-MQCC-N20 | R-GDIP-T20 | R-GDIP-T20 | R-GDIP-T20 | R-PDIP-T20 | R-GDFP-F20 | R-GDFP-F20 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| Number of functions | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | - | - | -55 °C | -55 °C |
| Package body material | METAL | METAL | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | QCCN | QCCN | DIP | DIP | DIP | DIP | DFP | DFP |
| Encapsulate equivalent code | LCC20,.35SQ | LCC20,.35SQ | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | FL20,.3 | FL20,.3 |
| Package shape | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK | FLATPACK |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | YES | YES | NO | NO | NO | NO | YES | YES |
| technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT |
| Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Trigger type | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| Maker | Monolithic Memories | - | - | Monolithic Memories | Monolithic Memories | Monolithic Memories | - | Monolithic Memories |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
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