D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, PDIP20,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Monolithic Memories |
package instruction | DIP, DIP20,.3 |
Reach Compliance Code | unknown |
JESD-30 code | R-PDIP-T20 |
JESD-609 code | e0 |
Logic integrated circuit type | D FLIP-FLOP |
Number of functions | 8 |
Number of terminals | 20 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP20,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
surface mount | NO |
technology | TTL |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
Trigger type | POSITIVE EDGE |
SN74S383N | SN54S383L883B | SN54S383J | SN54S383J883B | SN74S383J | SN54S383W | SN54S383L | SN54S383W883B | |
---|---|---|---|---|---|---|---|---|
Description | D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, PDIP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, MQCC20, | D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, CDIP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, CDIP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, CDIP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, CDFP20, | D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, MQCC20, | D Flip-Flop, 8-Func, Positive Edge Triggered, TTL, CDFP20, |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DFP, FL20,.3 | QCCN, LCC20,.35SQ | DFP, FL20,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 code | R-PDIP-T20 | S-MQCC-N20 | R-GDIP-T20 | R-GDIP-T20 | R-GDIP-T20 | R-GDFP-F20 | S-MQCC-N20 | R-GDFP-F20 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
Logic integrated circuit type | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
Number of functions | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
Maximum operating temperature | 70 °C | 125 °C | 125 °C | 125 °C | 70 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | - | -55 °C | -55 °C | -55 °C | - | -55 °C | -55 °C | -55 °C |
Package body material | PLASTIC/EPOXY | METAL | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | METAL | CERAMIC, GLASS-SEALED |
encapsulated code | DIP | QCCN | DIP | DIP | DIP | DFP | QCCN | DFP |
Encapsulate equivalent code | DIP20,.3 | LCC20,.35SQ | DIP20,.3 | DIP20,.3 | DIP20,.3 | FL20,.3 | LCC20,.35SQ | FL20,.3 |
Package shape | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
Package form | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | FLATPACK | CHIP CARRIER | FLATPACK |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
surface mount | NO | YES | NO | NO | NO | YES | YES | YES |
technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
Temperature level | COMMERCIAL | MILITARY | MILITARY | MILITARY | COMMERCIAL | MILITARY | MILITARY | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | NO LEAD | FLAT |
Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL |
Trigger type | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
Maker | Monolithic Memories | - | - | Monolithic Memories | Monolithic Memories | - | Monolithic Memories | Monolithic Memories |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
Maximum time at peak reflow temperature | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |