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WS512K32NV-85HMA

Description
SRAM Module, 512KX32, 85ns, CMOS, CHIP66, CERAMIC, HIP-66
Categorystorage    storage   
File Size212KB,8 Pages
ManufacturerWhite Microelectronics
Download Datasheet Parametric View All

WS512K32NV-85HMA Overview

SRAM Module, 512KX32, 85ns, CMOS, CHIP66, CERAMIC, HIP-66

WS512K32NV-85HMA Parametric

Parameter NameAttribute value
MakerWhite Microelectronics
package instructionCERAMIC, HIP-66
Reach Compliance Codeunknown
Maximum access time85 ns
JESD-30 codeS-CHIP-P66
memory density16777216 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals66
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512KX32
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeSQUARE
Package formIN-LINE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal formPIN/PEG
Terminal locationHEX
WS512K32V-XXX
HI-RELIABILITY PRODUCT
512Kx32 SRAM 3.3V MODULE
FEATURES
s
Access Times of 70, 85, 100, 120ns
s
Packaging
• 66-pin, PGA Type, 1.185 inch square, Hermetic
Ceramic HIP (Package 401)
ADVANCED*
s
Low Voltage
• 3.3V
±10%
Power Supply
s
Low Power CMOS
s
Built-in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation
s
Weight
WS512K32V-XG2TX - 8 grams typical
WS512K32V-XHX - 13 grams typical
* This data sheet describes a product that may or may not be under development
and is subject to change or cancellation without notice.
• 68 lead, Hermetic CQFP (G2T), 22.4mm (0.880 inch) square
4.57mm (0.180 inch) high (Package 509). Designed to fit
JEDEC 68 lead 0.990" CQFJ footprint.
s
Organized as 512Kx32, User Configurable as 1024Kx16 or
2Mx8
s
Commercial, Industrial and Military Temperature Ranges
s
TTL Compatible Inputs and Outputs
FIG. 1
1
I/O
8
I/O
9
I/O
10
A
13
A
14
A
15
A
16
A
17
I/O
0
I/O
1
I/O
2
11
PIN CONFIGURATION FOR WS512K32V-XHX
TOP VIEW
12
WE
2
CS
2
GND
I/O
11
A
10
A
11
A
12
V
CC
CS
1
NC
I/O
3
22
33
23
I/O
15
I/O
14
I/O
13
I/O
12
OE
A
18
WE
1
I/O
7
I/O
6
I/O
5
I/O
4
I/O
24
I/O
25
I/O
26
A
6
A
7
NC
A
8
A
9
I/O
16
I/O
17
I/O
18
44
34
V
CC
CS
4
WE
4
I/O
27
A
3
A
4
A
5
WE
3
CS
3
GND
I/O
19
55
45
I/O
31
I/O
30
I/O
29
I/O
28
A
0
A
1
A
2
I/O
23
I/O
22
I/O
21
I/O
20
8
8
8
8
PIN DESCRIPTION
56
I/O
0
-
31
A
0-18
WE
1-4
CS
1-4
OE
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
BLOCK DIAGRAM
W E
1
CS
1
OE
A
0
-
18
512K x 8
512K x 8
W E
2
CS
2
W E
3
CS
3
W E
4
CS
4
512K x 8
512K x 8
66
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
February 2000 Rev. 2
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com
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