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MC14517BCPD

Description
IC,SHIFT REGISTER,CMOS,DIP,16PIN,PLASTIC
Categorylogic    logic   
File Size397KB,6 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
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MC14517BCPD Overview

IC,SHIFT REGISTER,CMOS,DIP,16PIN,PLASTIC

MC14517BCPD Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNXP
package instructionDIP, DIP16,.3
Reach Compliance Codeunknown
Counting directionRIGHT
JESD-30 codeR-PDIP-T16
JESD-609 codee0
Number of digits64
Number of functions2
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply5/15 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

MC14517BCPD Related Products

MC14517BCPD MC14517BDW MC14517BALD MC14517BCLDS MC14517BCL MC14517BCPDS MC14517BCLD
Description IC,SHIFT REGISTER,CMOS,DIP,16PIN,PLASTIC IC,SHIFT REGISTER,CMOS,SOP,16PIN,PLASTIC IC,SHIFT REGISTER,CMOS,DIP,16PIN,CERAMIC IC,SHIFT REGISTER,CMOS,DIP,16PIN,CERAMIC IC,SHIFT REGISTER,CMOS,DIP,16PIN,CERAMIC IC,SHIFT REGISTER,CMOS,DIP,16PIN,PLASTIC IC,SHIFT REGISTER,CMOS,DIP,16PIN,CERAMIC
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP16,.3 SOP, SOP16,.4 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
Counting direction RIGHT RIGHT RIGHT RIGHT RIGHT RIGHT RIGHT
JESD-30 code R-PDIP-T16 R-PDSO-G16 R-XDIP-T16 R-XDIP-T16 R-XDIP-T16 R-PDIP-T16 R-XDIP-T16
JESD-609 code e0 e0 e0 e0 e0 e0 e0
Number of digits 64 64 64 64 64 64 64
Number of functions 2 2 2 2 2 2 2
Number of terminals 16 16 16 16 16 16 16
Maximum operating temperature 85 °C 125 °C 125 °C 85 °C 125 °C 85 °C 85 °C
Minimum operating temperature -40 °C -55 °C -55 °C -40 °C -55 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC CERAMIC CERAMIC PLASTIC/EPOXY CERAMIC
encapsulated code DIP SOP DIP DIP DIP DIP DIP
Encapsulate equivalent code DIP16,.3 SOP16,.4 DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3 DIP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
power supply 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V
surface mount NO YES NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL MILITARY MILITARY INDUSTRIAL MILITARY INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE GULL WING THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maker NXP - NXP NXP NXP NXP NXP

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