MC14517BCL datasheet, PDF - EEWORLD Datasheet

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MC14517BCL: DescriptionIC,SHIFT REGISTER,CMOS,DIP,16PIN,CERAMIC; Categorylogic logic; File Size397KB，6 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MC14517BCL Overview

IC,SHIFT REGISTER,CMOS,DIP,16PIN,CERAMIC

MC14517BCL Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
package instruction	DIP, DIP16,.3
Reach Compliance Code	unknown
Counting direction	RIGHT
JESD-30 code	R-XDIP-T16
JESD-609 code	e0
Maximum Frequency@Nom-Sup	1500000 Hz
Number of digits	64
Number of functions	2
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP16,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5/15 V
Certification status	Not Qualified
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

MC14517BCL Related Products

	MC14517BCL	MC14517BDW	MC14517BALD	MC14517BCLDS	MC14517BCPDS	MC14517BCPD	MC14517BCLD
Description	IC,SHIFT REGISTER,CMOS,DIP,16PIN,CERAMIC	IC,SHIFT REGISTER,CMOS,SOP,16PIN,PLASTIC	IC,SHIFT REGISTER,CMOS,DIP,16PIN,CERAMIC	IC,SHIFT REGISTER,CMOS,DIP,16PIN,CERAMIC	IC,SHIFT REGISTER,CMOS,DIP,16PIN,PLASTIC	IC,SHIFT REGISTER,CMOS,DIP,16PIN,PLASTIC	IC,SHIFT REGISTER,CMOS,DIP,16PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP16,.3	SOP, SOP16,.4	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Counting direction	RIGHT	RIGHT	RIGHT	RIGHT	RIGHT	RIGHT	RIGHT
JESD-30 code	R-XDIP-T16	R-PDSO-G16	R-XDIP-T16	R-XDIP-T16	R-PDIP-T16	R-PDIP-T16	R-XDIP-T16
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
Number of digits	64	64	64	64	64	64	64
Number of functions	2	2	2	2	2	2	2
Number of terminals	16	16	16	16	16	16	16
Maximum operating temperature	125 °C	125 °C	125 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC
encapsulated code	DIP	SOP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP16,.3	SOP16,.4	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V	5/15 V
surface mount	NO	YES	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	NXP	-	NXP	NXP	NXP	NXP	NXP

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