SN74HC180N3 datasheet, PDF - EEWORLD Datasheet

SN74HC180N3: DescriptionSN74HC180N3; Categorylogic logic; File Size172KB，4 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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SN74HC180N3

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DIP, DIP14,.3
Reach Compliance Code	not_compliant
JESD-30 code	R-PDIP-T14
Logic integrated circuit type	PARITY GENERATOR/CHECKER
Number of terminals	14
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

	SN74HC180N3	SN74HC180D3	SN74HC180N1	SN74HC180NP1	SN74HC180NP3
Description	SN74HC180N3	SN74HC180D3	IC,PARITY GENERATOR/CHECKER,HC-CMOS,DIP,14PIN,PLASTIC	IC,PARITY GENERATOR/CHECKER,HC-CMOS,DIP,14PIN,PLASTIC	SN74HC180NP3
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	DIP, DIP14,.3	SOP, SOP14,.25	DIP, DIP14,.3	DIP, DIP14,.3	DIP, DIP14,.3
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
JESD-30 code	R-PDIP-T14	R-PDSO-G14	R-PDIP-T14	R-PDIP-T14	R-PDIP-T14
Logic integrated circuit type	PARITY GENERATOR/CHECKER	PARITY GENERATOR/CHECKER	PARITY GENERATOR/CHECKER	PARITY GENERATOR/CHECKER	PARITY GENERATOR/CHECKER
Number of terminals	14	14	14	14	14
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	DIP	DIP	DIP
Encapsulate equivalent code	DIP14,.3	SOP14,.25	DIP14,.3	DIP14,.3	DIP14,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE
surface mount	NO	YES	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL

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