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M24C32-WDW5B

Description
4KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.169 INCH, TSSOP-8
Categorystorage    storage   
File Size269KB,34 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
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M24C32-WDW5B Overview

4KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.169 INCH, TSSOP-8

M24C32-WDW5B Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSTMicroelectronics
Parts packaging codeSOIC
package instructionTSSOP,
Contacts8
Reach Compliance Codecompliant
Maximum clock frequency (fCLK)0.4 MHz
JESD-30 codeR-PDSO-G8
JESD-609 codee0
length4.4 mm
memory density32768 bit
Memory IC TypeEEPROM
memory width8
Number of functions1
Number of terminals8
word count4096 words
character code4000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-20 °C
organize4KX8
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height1.2 mm
Serial bus typeI2C
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2.5 V
Nominal supply voltage (Vsup)2.7 V
surface mountYES
Temperature levelOTHER
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width3 mm
Maximum write cycle time (tWC)5 ms
M24C64-W M24C64-R M24C64-F
M24C32-W M24C32-R M24C32-F
64 Kbit and 32 Kbit Serial I²C bus EEPROM
Feature summary
Two-Wire I
2
C serial interface
Supports 400kHz Protocol
Single supply voltage:
– 2.5 to 5.5V for M24Cxx-W
– 1.8 to 5.5V for M24Cxx-R
– 1.7 to 5.5V for M25Cxx-F
Write Control Input
Byte and Page Write (up to 32 Bytes)
Random And Sequential Read modes
Self-Timed programming cycle
Automatic address incrementing
Enhanced ESD/Latch-Up Protection
More than 1 Million Write cycles
More than 40-year data retention
SO8 (MN)
150 mil width
PDIP8 (BN)
TSSOP8 (DW)
169 mil width
UFDFPN8 (MB)
2x3mm² (MLP)
July 2006
Rev 8
1/34
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