CY7C0852V-150BGI datasheet, PDF

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CY7C0852V-150BGI: DescriptionDual-Port SRAM, 128KX36, 3.8ns, CMOS, PBGA172, 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172; Categorystorage storage; File Size411KB，30 Pages; ManufacturerCypress Semiconductor

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CY7C0852V-150BGI Overview

Dual-Port SRAM, 128KX36, 3.8ns, CMOS, PBGA172, 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172

CY7C0852V-150BGI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Cypress Semiconductor
Parts packaging code	BGA
package instruction	15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172
Contacts	172
Reach Compliance Code	compliant
ECCN code	3A991.B.2.A
Maximum access time	3.8 ns
I/O type	COMMON
JESD-30 code	S-PBGA-B172
JESD-609 code	e0
length	15 mm
memory density	4718592 bit
Memory IC Type	DUAL-PORT SRAM
memory width	36
Number of functions	1
Number of ports	2
Number of terminals	172
word count	131072 words
character code	128000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128KX36
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Encapsulate equivalent code	BGA172,14X14,40
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	1.25 mm
Minimum standby current	3.14 V
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15 mm

CY7C0852V-150BGI Related Products

	CY7C0852V-150BGI	CY7C0852V-133BGC	ADM6319CZ25ARJZRL7	CY7C0852V-100BGC	CY7C0852V-133BGI	CY7C0852V-100BGI
Description	Dual-Port SRAM, 128KX36, 3.8ns, CMOS, PBGA172, 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172	Dual-Port SRAM, 128KX36, 4.2ns, CMOS, PBGA172, 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172	Supervisory Circuits with Watchdog and Manual Reset in 5-Lead SOT-23	Dual-Port SRAM, 128KX36, 5ns, CMOS, PBGA172, 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172	Dual-Port SRAM, 128KX36, 4.2ns, CMOS, PBGA172, 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172	Dual-Port SRAM, 128KX36, 5ns, CMOS, PBGA172, 15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172
Is it Rohs certified?	incompatible	incompatible	-	incompatible	incompatible	incompatible
Maker	Cypress Semiconductor	-	-	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor
Parts packaging code	BGA	BGA	-	BGA	BGA	BGA
package instruction	15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172	15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172	-	15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172	15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172	15 X 15 MM, 0.51 MM HEIGHT, 1 MM PITCH, BGA-172
Contacts	172	172	-	172	172	172
Reach Compliance Code	compliant	compliant	-	compliant	compliant	compliant
ECCN code	3A991.B.2.A	3A991.B.2.A	-	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	3.8 ns	4.2 ns	-	5 ns	4.2 ns	5 ns
I/O type	COMMON	COMMON	-	COMMON	COMMON	COMMON
JESD-30 code	S-PBGA-B172	S-PBGA-B172	-	S-PBGA-B172	S-PBGA-B172	S-PBGA-B172
JESD-609 code	e0	e0	-	e0	e0	e0
length	15 mm	15 mm	-	15 mm	15 mm	15 mm
memory density	4718592 bit	4718592 bit	-	4718592 bit	4718592 bit	4718592 bit
Memory IC Type	DUAL-PORT SRAM	DUAL-PORT SRAM	-	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM
memory width	36	36	-	36	36	36
Number of functions	1	1	-	1	1	1
Number of ports	2	2	-	2	2	2
Number of terminals	172	172	-	172	172	172
word count	131072 words	131072 words	-	131072 words	131072 words	131072 words
character code	128000	128000	-	128000	128000	128000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	-	70 °C	85 °C	85 °C
organize	128KX36	128KX36	-	128KX36	128KX36	128KX36
Output characteristics	3-STATE	3-STATE	-	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LBGA	LBGA	-	LBGA	LBGA	LBGA
Encapsulate equivalent code	BGA172,14X14,40	BGA172,14X14,40	-	BGA172,14X14,40	BGA172,14X14,40	BGA172,14X14,40
Package shape	SQUARE	SQUARE	-	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	-	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL	-	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3 V	3.3 V	-	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.25 mm	1.25 mm	-	1.25 mm	1.25 mm	1.25 mm
Minimum standby current	3.14 V	3.14 V	-	3.14 V	3.14 V	3.14 V
Maximum supply voltage (Vsup)	3.465 V	3.465 V	-	3.465 V	3.465 V	3.465 V
Minimum supply voltage (Vsup)	3.135 V	3.135 V	-	3.135 V	3.135 V	3.135 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	-	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	-	YES	YES	YES
technology	CMOS	CMOS	-	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	-	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	BALL	BALL	-	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	-	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	-	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	15 mm	15 mm	-	15 mm	15 mm	15 mm

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