FIFO, 1KX9, 120ns, Asynchronous, CMOS, PDIP28,
Parameter Name | Attribute value |
Maker | DALLAS |
Reach Compliance Code | unknown |
Maximum access time | 120 ns |
Other features | RETRANSMIT |
period time | 140 ns |
JESD-30 code | R-PDIP-T28 |
memory density | 9216 bit |
memory width | 9 |
Number of functions | 1 |
Number of terminals | 28 |
word count | 1024 words |
character code | 1000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1KX9 |
Exportable | NO |
Package body material | PLASTIC/EPOXY |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Certification status | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | THROUGH-HOLE |
Terminal location | DUAL |
DS2010 | DS2010R | DS2011R | DS2011D | DS2013D | DS2009D | DS2009R | DS2013 | DS2011 | DS2010D | |
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Description | FIFO, 1KX9, 120ns, Asynchronous, CMOS, PDIP28, | FIFO, 1KX9, 120ns, Asynchronous, CMOS, PQCC32, | FIFO, 2KX9, 120ns, Asynchronous, CMOS, PQCC32, | FIFO, 2KX9, 120ns, Asynchronous, CMOS, PDIP28, | FIFO, 8KX9, 120ns, Asynchronous, CMOS, PDIP28, | FIFO, 512X9, 120ns, Asynchronous, CMOS, PDIP28, | FIFO, 512X9, 120ns, Asynchronous, CMOS, PQCC32, | FIFO, 8KX9, 120ns, Asynchronous, CMOS, PDIP28, | FIFO, 2KX9, 120ns, Asynchronous, CMOS, PDIP28, | FIFO, 1KX9, 120ns, Asynchronous, CMOS, PDIP28, |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Maximum access time | 120 ns | 120 ns | 120 ns | 120 ns | 120 ns | 120 ns | 120 ns | 120 ns | 120 ns | 120 ns |
Other features | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT |
period time | 140 ns | 140 ns | 140 ns | 140 ns | 140 ns | 140 ns | 140 ns | 140 ns | 140 ns | 140 ns |
JESD-30 code | R-PDIP-T28 | R-PQCC-J32 | R-PQCC-J32 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PQCC-J32 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 |
memory density | 9216 bit | 9216 bit | 18432 bit | 18432 bit | 73728 bit | 4608 bit | 4608 bit | 73728 bit | 18432 bit | 9216 bit |
memory width | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 28 | 32 | 32 | 28 | 28 | 28 | 32 | 28 | 28 | 28 |
word count | 1024 words | 1024 words | 2048 words | 2048 words | 8192 words | 512 words | 512 words | 8192 words | 2048 words | 1024 words |
character code | 1000 | 1000 | 2000 | 2000 | 8000 | 512 | 512 | 8000 | 2000 | 1000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 1KX9 | 1KX9 | 2KX9 | 2KX9 | 8KX9 | 512X9 | 512X9 | 8KX9 | 2KX9 | 1KX9 |
Exportable | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | IN-LINE |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | YES | YES | NO | NO | NO | YES | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal location | DUAL | QUAD | QUAD | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL |
Maker | DALLAS | - | - | - | DALLAS | DALLAS | DALLAS | DALLAS | DALLAS | DALLAS |