Flash PLD, 12ns, 128-Cell, CMOS, PQFP160
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Cypress Semiconductor |
Reach Compliance Code | not_compliant |
Other features | NO |
In-system programmable | NO |
JESD-30 code | S-PQFP-G160 |
JESD-609 code | e0 |
JTAG BST | NO |
Number of macro cells | 128 |
Number of terminals | 160 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | QFP |
Encapsulate equivalent code | QFP160,1.2SQ |
Package shape | SQUARE |
Package form | FLATPACK |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Programmable logic type | FLASH PLD |
propagation delay | 12 ns |
Certification status | Not Qualified |
Nominal supply voltage | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 0.635 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
CY7C375-12NC | CY7C375-20NC | CY7C375-15NC | CY7C375-20GMB | CY7C375-15GMB | |
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Description | Flash PLD, 12ns, 128-Cell, CMOS, PQFP160 | Flash PLD, 20ns, 128-Cell, CMOS, PQFP160 | Flash PLD, 15ns, 128-Cell, CMOS, PQFP160 | Flash PLD, 20ns, 128-Cell, CMOS, CPGA160 | Flash PLD, 15ns, 128-Cell, CMOS, CPGA160 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
Other features | NO | NO | NO | NO | NO |
In-system programmable | NO | NO | NO | NO | NO |
JESD-30 code | S-PQFP-G160 | S-PQFP-G160 | S-PQFP-G160 | S-XPGA-P160 | S-XPGA-P160 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 |
JTAG BST | NO | NO | NO | NO | NO |
Number of macro cells | 128 | 128 | 128 | 128 | 128 |
Number of terminals | 160 | 160 | 160 | 160 | 160 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC |
encapsulated code | QFP | QFP | QFP | PGA | PGA |
Encapsulate equivalent code | QFP160,1.2SQ | QFP160,1.2SQ | QFP160,1.2SQ | PGA160M,15X15 | PGA160M,15X15 |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | FLATPACK | FLATPACK | FLATPACK | GRID ARRAY | GRID ARRAY |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
Programmable logic type | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD | FLASH PLD |
propagation delay | 12 ns | 20 ns | 15 ns | 20 ns | 15 ns |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING | GULL WING | GULL WING | PIN/PEG | PIN/PEG |
Terminal pitch | 0.635 mm | 0.635 mm | 0.635 mm | 2.54 mm | 2.54 mm |
Terminal location | QUAD | QUAD | QUAD | PERPENDICULAR | PERPENDICULAR |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |