CY7C375-20GMB datasheet, PDF - EEWORLD Datasheet

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CY7C375-20GMB: DescriptionFlash PLD, 20ns, 128-Cell, CMOS, CPGA160; CategoryProgrammable logic devices Programmable logic; File Size787KB，11 Pages; ManufacturerCypress Semiconductor

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CY7C375-20GMB Overview

Flash PLD, 20ns, 128-Cell, CMOS, CPGA160

CY7C375-20GMB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Cypress Semiconductor
Reach Compliance Code	not_compliant
Other features	NO
In-system programmable	NO
JESD-30 code	S-XPGA-P160
JESD-609 code	e0
JTAG BST	NO
Number of macro cells	128
Number of terminals	160
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	PGA
Encapsulate equivalent code	PGA160M,15X15
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Programmable logic type	FLASH PLD
propagation delay	20 ns
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED

CY7C375-20GMB Related Products

	CY7C375-20GMB	CY7C375-20NC	CY7C375-12NC	CY7C375-15NC	CY7C375-15GMB
Description	Flash PLD, 20ns, 128-Cell, CMOS, CPGA160	Flash PLD, 20ns, 128-Cell, CMOS, PQFP160	Flash PLD, 12ns, 128-Cell, CMOS, PQFP160	Flash PLD, 15ns, 128-Cell, CMOS, PQFP160	Flash PLD, 15ns, 128-Cell, CMOS, CPGA160
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
Other features	NO	NO	NO	NO	NO
In-system programmable	NO	NO	NO	NO	NO
JESD-30 code	S-XPGA-P160	S-PQFP-G160	S-PQFP-G160	S-PQFP-G160	S-XPGA-P160
JESD-609 code	e0	e0	e0	e0	e0
JTAG BST	NO	NO	NO	NO	NO
Number of macro cells	128	128	128	128	128
Number of terminals	160	160	160	160	160
Maximum operating temperature	125 °C	70 °C	70 °C	70 °C	125 °C
Package body material	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC
encapsulated code	PGA	QFP	QFP	QFP	PGA
Encapsulate equivalent code	PGA160M,15X15	QFP160,1.2SQ	QFP160,1.2SQ	QFP160,1.2SQ	PGA160M,15X15
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	FLATPACK	FLATPACK	FLATPACK	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V
Programmable logic type	FLASH PLD	FLASH PLD	FLASH PLD	FLASH PLD	FLASH PLD
propagation delay	20 ns	20 ns	12 ns	15 ns	15 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	PIN/PEG	GULL WING	GULL WING	GULL WING	PIN/PEG
Terminal pitch	2.54 mm	0.635 mm	0.635 mm	0.635 mm	2.54 mm
Terminal location	PERPENDICULAR	QUAD	QUAD	QUAD	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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