B554-2T datasheet, PDF - EEWORLD Datasheet

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B554-2T: DescriptionSCR; CategoryAnalog mixed-signal IC Trigger device; File Size797KB，5 Pages; ManufacturerCrydom; Websitehttp://www.crydom.com/en/index.shtml; Environmental Compliance

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B554-2T Overview

SCR

B554-2T Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Crydom
package instruction	FLANGE MOUNT, R-XUFM-D4
Contacts	4
Reach Compliance Code	compliant
ECCN code	EAR99
Other features	UL RECOGNIZED
Shell connection	ISOLATED
Configuration	ANTI-PARALLEL, 2 ELEMENTS
Critical rise rate of minimum off-state voltage	500 V/us
Maximum DC gate trigger current	60 mA
Maximum DC gate trigger voltage	2.5 V
Quick connection description	2G-4AK
Description of screw terminals	0
JESD-30 code	R-XUFM-D4
On-state non-repetitive peak current	325 A
Number of components	2
Number of terminals	4
Maximum on-state current	27000 A
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	UNSPECIFIED
Package shape	RECTANGULAR
Package form	FLANGE MOUNT
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Repeated peak reverse voltage	1200 V
surface mount	NO
Terminal surface	COPPER
Terminal form	SOLDER LUG
Terminal location	UPPER
Maximum time at peak reflow temperature	NOT SPECIFIED
Trigger device type	SCR
Base Number Matches	1

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B-2T, B-2 Series

•

Eight Circuits to Choose from

•

For AC or DC Variable Voltage

Output Up to 15KW

• UL Recognized E72445

AVAILABLE OPTIONS

ELECTRICAL SPECIFICATIONS

Description

Maximum DC Output Current (Tc = 85°C)

Maximum Voltage Drop @ Amps Peak

Operating Junction Temperature Range

Critical Rate of Rise of On-State Current @ TJ=125°C

Critical Rate of Rise of Off-State Voltage [V/µs]

AC Line Input Voltage (Repetitive Peak Reverse Voltage)

Maximum Non-Repetitive Surge Current (1/2 Cycle, 60 Hz)

Maximum I²T for Fusing (t=8.3ms) [A²sec]

Minimum Required Gate Current to Trigger @ 25°C

Minimum Required Gate Voltage to Trigger @ 25°C

Average Gate Power

Maximum Peak Reverse Gate Voltage

Maximum Thermal Resistance, Junction to Ceramic Base per Chip

Isolation Voltage

Symbol

di/dt

dv/dt

RMS

TSM

G(AV)

ISOL

25A

1.65V @ 25A

-40 - 125°C

100A/µs

500V/µs

120 (400V

RRM)

240 (600V

RRM)

280 (800V

RRM)

480 (1200V

RRM)

250A

260

60mA

2.5V

0.5W

5.0V

0.9°C/W

2500 Vrms

42.5A

1.65V @ 42.5A

-40 - 125°C

100A/µs

500V/µs

120 (400V

RRM)

240 (600V

RRM)

280(800V

RRM)

480(1200V

RRM)

600A

1500

80mA

3.0V

0.5W

5.0V

0.7°C/W

2500 Vrms

GENERAL SPECIFICATIONS

Description

Weight (typical)

1.5 oz (42.5g)

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Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

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