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CY7C0430BV-100BGIT

Description
64KX18 FOUR-PORT SRAM, 5ns, PBGA272, 27 X 27 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-272
Categorystorage    storage   
File Size2MB,38 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
Download Datasheet Parametric Compare View All

CY7C0430BV-100BGIT Overview

64KX18 FOUR-PORT SRAM, 5ns, PBGA272, 27 X 27 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-272

CY7C0430BV-100BGIT Parametric

Parameter NameAttribute value
MakerRochester Electronics
Parts packaging codeBGA
package instruction27 X 27 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-272
Contacts272
Reach Compliance Codeunknown
Maximum access time5 ns
Other featuresPIPELINED ARCHITECTURE
JESD-30 codeS-PBGA-B272
JESD-609 codee0
length27 mm
memory density1179648 bit
Memory IC TypeFOUR-PORT SRAM
memory width18
Number of functions1
Number of terminals272
word count65536 words
character code64000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize64KX18
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Certification statusCOMMERCIAL
Maximum seat height2.46 mm
Maximum supply voltage (Vsup)3.45 V
Minimum supply voltage (Vsup)3.15 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
width27 mm

CY7C0430BV-100BGIT Related Products

CY7C0430BV-100BGIT CY7C0430BV-100BGI
Description 64KX18 FOUR-PORT SRAM, 5ns, PBGA272, 27 X 27 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-272 64KX18 FOUR-PORT SRAM, 5ns, PBGA272, 27 X 27 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-272
Maker Rochester Electronics Rochester Electronics
Parts packaging code BGA BGA
package instruction 27 X 27 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-272 27 X 27 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-272
Contacts 272 272
Reach Compliance Code unknown unknown
Maximum access time 5 ns 5 ns
Other features PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 code S-PBGA-B272 S-PBGA-B272
JESD-609 code e0 e0
length 27 mm 27 mm
memory density 1179648 bit 1179648 bit
Memory IC Type FOUR-PORT SRAM FOUR-PORT SRAM
memory width 18 18
Number of functions 1 1
Number of terminals 272 272
word count 65536 words 65536 words
character code 64000 64000
Operating mode SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
organize 64KX18 64KX18
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA
Package shape SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Certification status COMMERCIAL COMMERCIAL
Maximum seat height 2.46 mm 2.46 mm
Maximum supply voltage (Vsup) 3.45 V 3.45 V
Minimum supply voltage (Vsup) 3.15 V 3.15 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface TIN LEAD TIN LEAD
Terminal form BALL BALL
Terminal pitch 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM
width 27 mm 27 mm
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