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CD4008AF

Description
Adder/Subtractor, CMOS, CDIP16,
Categorylogic    logic   
File Size123KB,2 Pages
ManufacturerRCA
Download Datasheet Parametric Compare View All

CD4008AF Overview

Adder/Subtractor, CMOS, CDIP16,

CD4008AF Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerRCA
package instructionDIP, DIP16,.3
Reach Compliance Codeunknown
JESD-30 codeR-XDIP-T16
JESD-609 codee0
Logic integrated circuit typeADDER/SUBTRACTOR
Number of terminals16
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply3/15 V
Certification statusNot Qualified
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

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This Material Copyrighted By Its Respective Manufacturer
This Material Copyrighted By Its Respective Manufacturer

CD4008AF Related Products

CD4008AF CD4008AD CD4008AE CD4008AH
Description Adder/Subtractor, CMOS, CDIP16, Adder/Subtractor, CMOS, CDIP16 Adder/Subtractor, CMOS, PDIP16 Adder/Subtractor, CMOS
Maker RCA RCA RCA RCA
package instruction DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3 , DIE OR CHIP
Reach Compliance Code unknown unknown unknown unknown
Logic integrated circuit type ADDER/SUBTRACTOR ADDER/SUBTRACTOR ADDER/SUBTRACTOR ADDER/SUBTRACTOR
Maximum operating temperature 125 °C 125 °C 85 °C 125 °C
Minimum operating temperature -55 °C -55 °C -40 °C -55 °C
Encapsulate equivalent code DIP16,.3 DIP16,.3 DIP16,.3 DIE OR CHIP
power supply 3/15 V 3/15 V 3/15 V 3/15 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
technology CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY INDUSTRIAL MILITARY
Is it Rohs certified? incompatible incompatible incompatible -
JESD-30 code R-XDIP-T16 R-XDIP-T16 R-PDIP-T16 -
JESD-609 code e0 e0 e0 -
Number of terminals 16 16 16 -
Package body material CERAMIC CERAMIC PLASTIC/EPOXY -
encapsulated code DIP DIP DIP -
Package shape RECTANGULAR RECTANGULAR RECTANGULAR -
Package form IN-LINE IN-LINE IN-LINE -
surface mount NO NO NO -
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE -
Terminal pitch 2.54 mm 2.54 mm 2.54 mm -
Terminal location DUAL DUAL DUAL -
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