DM77S184AJ datasheet, PDF - EEWORLD Datasheet

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DM77S184AJ: DescriptionIC 2K X 4 OTPROM, 60 ns, CDIP18, CERAMIC, DIP-18, Programmable ROM; Categorystorage storage; File Size119KB，4 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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DM77S184AJ Overview

IC 2K X 4 OTPROM, 60 ns, CDIP18, CERAMIC, DIP-18, Programmable ROM

DM77S184AJ Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Texas Instruments
Parts packaging code	DIP
package instruction	DIP, DIP18,.3
Contacts	18
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	60 ns
JESD-30 code	R-GDIP-T18
JESD-609 code	e0
memory density	8192 bit
Memory IC Type	OTP ROM
memory width	4
Number of functions	1
Number of terminals	18
word count	2048 words
character code	2000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	2KX4
Output characteristics	OPEN-COLLECTOR
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP18,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum slew rate	0.14 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	BIPOLAR
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

DM77S184AJ Related Products

	DM77S184AJ	DM87S184AN	DM87S184AJ	DM87S184AV	DM87S184AVX	DM87S184J	DM87S184VX	DM87S184N	DM77S184J	DM87S184V
Description	IC 2K X 4 OTPROM, 60 ns, CDIP18, CERAMIC, DIP-18, Programmable ROM	2KX4 OTPROM, 45ns, PDIP18, PLASTIC, DIP-18	2KX4 OTPROM, 45ns, CDIP18, CERAMIC, DIP-18	2KX4 OTPROM, 45ns, PQCC20, PLASTIC, LCC-20	IC 2K X 4 OTPROM, 45 ns, PQCC20, PLASTIC, LCC-20, Programmable ROM	2KX4 OTPROM, 55ns, CDIP18, CERAMIC, DIP-18	IC 2K X 4 OTPROM, 55 ns, PQCC20, PLASTIC, LCC-20, Programmable ROM	IC 2K X 4 OTPROM, 55 ns, PDIP18, PLASTIC, DIP-18, Programmable ROM	2KX4 OTPROM, 70ns, CDIP18, CERAMIC, DIP-18	2KX4 OTPROM, 55ns, PQCC20, PLASTIC, LCC-20
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Parts packaging code	DIP	DIP	DIP	QLCC	QLCC	DIP	QLCC	DIP	DIP	QLCC
package instruction	DIP, DIP18,.3	DIP, DIP18,.3	DIP, DIP18,.3	QCCJ, LDCC20,.4SQ	QCCJ,	DIP, DIP18,.3	QCCJ,	DIP, DIP18,.3	DIP, DIP18,.3	QCCJ, LDCC20,.4SQ
Contacts	18	18	18	20	20	18	20	18	18	20
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	60 ns	45 ns	45 ns	45 ns	45 ns	55 ns	55 ns	55 ns	70 ns	55 ns
JESD-30 code	R-GDIP-T18	R-PDIP-T18	R-GDIP-T18	S-PQCC-J20	S-PQCC-J20	R-GDIP-T18	S-PQCC-J20	R-PDIP-T18	R-GDIP-T18	S-PQCC-J20
memory density	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	4	4	4	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of terminals	18	18	18	20	20	18	20	18	18	20
word count	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words
character code	2000	2000	2000	2000	2000	2000	2000	2000	2000	2000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	125 °C	70 °C
organize	2KX4	2KX4	2KX4	2KX4	2KX4	2KX4	2KX4	2KX4	2KX4	2KX4
Output characteristics	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR
Package body material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	QCCJ	QCCJ	DIP	QCCJ	DIP	DIP	QCCJ
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	SQUARE
Package form	IN-LINE	IN-LINE	IN-LINE	CHIP CARRIER	CHIP CARRIER	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	CHIP CARRIER
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	5.08 mm	5.08 mm	4.57 mm	4.57 mm	5.08 mm	4.57 mm	5.08 mm	5.08 mm	4.57 mm
Maximum supply voltage (Vsup)	5.5 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.5 V	5.25 V
Minimum supply voltage (Vsup)	4.5 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.5 V	4.75 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	YES	YES	NO	YES	NO	NO	YES
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND	THROUGH-HOLE	J BEND	THROUGH-HOLE	THROUGH-HOLE	J BEND
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	QUAD	QUAD	DUAL	QUAD	DUAL	DUAL	QUAD
width	7.62 mm	7.62 mm	7.62 mm	8.89 mm	8.89 mm	7.62 mm	8.89 mm	7.62 mm	7.62 mm	8.89 mm
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	-	Contains lead	-	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	-	incompatible	-	incompatible	incompatible	incompatible
JESD-609 code	e0	e0	e0	e0	-	e0	-	e0	e0	e0
Encapsulate equivalent code	DIP18,.3	DIP18,.3	DIP18,.3	LDCC20,.4SQ	-	DIP18,.3	-	DIP18,.3	DIP18,.3	LDCC20,.4SQ
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Maximum slew rate	0.14 mA	0.14 mA	0.14 mA	0.14 mA	-	0.14 mA	-	0.14 mA	0.14 mA	0.14 mA
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
length	-	21.755 mm	-	8.89 mm	8.89 mm	-	8.89 mm	21.755 mm	-	8.89 mm

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