DM52B33H-300 datasheet, PDF - EEWORLD Datasheet

DM52B33H-300: DescriptionEEPROM, 8KX8, 300ns, Parallel, MOS, CDIP28; Categorystorage storage; File Size225KB，7 Pages; ManufacturerLSC/CSI; Websitehttps://lsicsi.com

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DM52B33H-300 Overview

EEPROM, 8KX8, 300ns, Parallel, MOS, CDIP28

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	LSC/CSI
package instruction	DIP, DIP28,.6
Reach Compliance Code	unknown
Maximum access time	300 ns
command user interface	NO
Data polling	NO
JESD-30 code	R-XDIP-T28
JESD-609 code	e0
memory density	65536 bit
Memory IC Type	EEPROM
memory width	8
Number of terminals	28
word count	8192 words
character code	8000
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	8KX8
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum standby current	0.05 A
Maximum slew rate	0.12 mA
surface mount	NO
technology	MOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
switch bit	NO

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