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Datasheet> All Categories > storage> storage> WEDPS512K32V-12BC
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WEDPS512K32V-12BC

Description
SRAM Module, 512KX32, 12ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143
Categorystorage    storage   
File Size126KB，7 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
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WEDPS512K32V-12BC Overview

SRAM Module, 512KX32, 12ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143

WEDPS512K32V-12BC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeBGA
package instruction16 X 18 MM, PLASTIC, BGA-143
Contacts143
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Maximum access time12 ns
Other featuresALSO CONFIGURABLE AS 2M X 8
Spare memory width16
I/O typeCOMMON
JESD-30 codeR-PBGA-B143
memory density16777216 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals143
word count524288 words
character code512000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX32
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA143,12X12,50
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Certification statusNot Qualified
Maximum standby current0.12 A
Minimum standby current3 V
Maximum slew rate0.4 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED

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White Electronic Designs
WEDPS512K32V-XBX
512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE
FEATURES
n
Access Times of 12, 15, 17, 20ns
n
Packaging
• 143 PBGA, 16mm x 18mm, 288mm
2
n
Organized as 512Kx32; User Configurable as 1Mx16 or
2Mx8
n
Commercial, Industrial and Military Temperature Ranges
n
Low Voltage Operation:
• 3.3V ± 10% Power Supply
n
Low Power CMOS
n
TTL Compatible Inputs and Outputs
n
Fully Static Operation:
• No clock or refresh required.
n
Three State Output.
Note: This data sheet describes a product that is subject to change without notice.
P
IN
C
ONFIGURATION
F
OR
WEDPS512K32V-XBX
T
OP
V
IEW
1
A
-
2
A2
A3
D8
D11
GND
GND
V
CC
V
CC
D0
D3
A6
A7
3
A1
A4
NC
GND
GND
GND
V
CC
V
CC
V
CC
NC
A5
A8
4
A0
D14
D12
GND
GND
GND
V
CC
V
CC
V
CC
D7
D6
A9
5
GND
D15
D13
GND
GND
GND
V
CC
V
CC
V
CC
D5
D4
V
CC
6
GND
NC
GND
GND
GND
GND
V
CC
V
CC
V
CC
V
CC
NC
V
CC
7
V
CC
CS4
V
CC
V
CC
V
CC
V
CC
GND
GND
GND
GND
WE3
GND
8
V
CC
D24
D26
V
CC
V
CC
V
CC
GND
GND
GND
D17
D19
GND
9
A18
D25
D27
V
CC
V
CC
V
CC
GND
GND
GND
D16
D18
A10
10
A17
OE
WE4
V
CC
V
CC
V
CC
GND
GND
GND
CS3
A14
A11
11
A16
A15
D31
D28
V
CC
V
CC
GND
GND
D23
D20
A13
A12
12
GND
NC
D30
D29
NC
V
CC
GND
NC
D22
D21
NC
V
CC
B
C
D
E
F
G
H
J
K
L
M
CS2
D9
D10
WE2
GND
V
CC
CS1
D1
D2
WE1
GND
P
IN
D
ESCRIPTION
I/O
0-31
A
0-18
WE
1-4
CS
1-4
OE
V
CC
GND
NC
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
Output Enable
Power Supply
Ground
Not Connected
8
B
LOCK
D
IAGRAM
W E
1
CS
1
OE
A
0
-
18
512K x 8
512K x 8
512K x 8
512K x 8
W E
2
CS
2
W E
3
CS
3
W E
4
CS
4
8
8
8
I/O
0-7
I/O
8-15
I/O
16-23
I/O
24-31
February 2003 Rev. 4
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

WEDPS512K32V-12BC Related Products

WEDPS512K32V-12BC WEDPS512K32V-17BC WEDPS512K32V-17BI WEDPS512K32V-15BC WEDPS512K32V-20BM WEDPS512K32V-20BI WEDPS512K32V-20BC WEDPS512K32V-15BM WEDPS512K32V-17BM
Description SRAM Module, 512KX32, 12ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 SRAM Module, 512KX32, 17ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 SRAM Module, 512KX32, 17ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 SRAM Module, 512KX32, 15ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 SRAM Module, 512KX32, 20ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 SRAM Module, 512KX32, 20ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 SRAM Module, 512KX32, 20ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 SRAM Module, 512KX32, 15ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143 SRAM Module, 512KX32, 17ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code BGA BGA BGA BGA BGA BGA BGA BGA BGA
package instruction 16 X 18 MM, PLASTIC, BGA-143 BGA, BGA143,12X12,50 BGA, BGA143,12X12,50 16 X 18 MM, PLASTIC, BGA-143 16 X 18 MM, PLASTIC, BGA-143 16 X 18 MM, PLASTIC, BGA-143 16 X 18 MM, PLASTIC, BGA-143 16 X 18 MM, PLASTIC, BGA-143 16 X 18 MM, PLASTIC, BGA-143
Contacts 143 143 143 143 143 143 143 143 143
Reach Compliance Code unknown compliant compliant unknown unknown unknown unknown unknown unknown
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A001.A.2.C 3A991.B.2.A 3A991.B.2.A 3A001.A.2.C 3A001.A.2.C
Maximum access time 12 ns 17 ns 17 ns 15 ns 20 ns 20 ns 20 ns 15 ns 17 ns
Other features ALSO CONFIGURABLE AS 2M X 8 ALSO CONFIGURABLE AS 2M X 8 ALSO CONFIGURABLE AS 2M X 8 ALSO CONFIGURABLE AS 2M X 8 ALSO CONFIGURABLE AS 2M X 8 ALSO CONFIGURABLE AS 2M X 8 ALSO CONFIGURABLE AS 2M X 8 ALSO CONFIGURABLE AS 2M X 8 ALSO CONFIGURABLE AS 2M X 8
Spare memory width 16 16 16 16 16 16 16 16 16
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PBGA-B143 R-PBGA-B143 R-PBGA-B143 R-PBGA-B143 R-PBGA-B143 R-PBGA-B143 R-PBGA-B143 R-PBGA-B143 R-PBGA-B143
memory density 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit 16777216 bit
Memory IC Type SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE
memory width 32 32 32 32 32 32 32 32 32
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 143 143 143 143 143 143 143 143 143
word count 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words 524288 words
character code 512000 512000 512000 512000 512000 512000 512000 512000 512000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 85 °C 70 °C 125 °C 85 °C 70 °C 125 °C 125 °C
Minimum operating temperature - - -40 °C - -55 °C -40 °C - -55 °C -55 °C
organize 512KX32 512KX32 512KX32 512KX32 512KX32 512KX32 512KX32 512KX32 512KX32
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA BGA BGA BGA BGA
Encapsulate equivalent code BGA143,12X12,50 BGA143,12X12,50 BGA143,12X12,50 BGA143,12X12,50 BGA143,12X12,50 BGA143,12X12,50 BGA143,12X12,50 BGA143,12X12,50 BGA143,12X12,50
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.12 A 0.12 A 0.12 A 0.12 A 0.12 A 0.12 A 0.12 A 0.12 A 0.12 A
Minimum standby current 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Maximum slew rate 0.4 mA 0.4 mA 0.4 mA 0.4 mA 0.4 mA 0.4 mA 0.4 mA 0.4 mA 0.4 mA
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL MILITARY INDUSTRIAL COMMERCIAL MILITARY MILITARY
Terminal form BALL BALL BALL BALL BALL BALL BALL BALL BALL
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Maker Microsemi - - Microsemi Microsemi Microsemi Microsemi Microsemi Microsemi

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Shortcut:   00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

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