WEDPS512K32V-20BI datasheet, PDF

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WEDPS512K32V-20BI: DescriptionSRAM Module, 512KX32, 20ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143; Categorystorage storage; File Size126KB，7 Pages; ManufacturerMicrosemi; Websitehttps://www.microsemi.com

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WEDPS512K32V-20BI Overview

SRAM Module, 512KX32, 20ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143

WEDPS512K32V-20BI Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Microsemi
Parts packaging code	BGA
package instruction	16 X 18 MM, PLASTIC, BGA-143
Contacts	143
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	20 ns
Other features	ALSO CONFIGURABLE AS 2M X 8
Spare memory width	16
I/O type	COMMON
JESD-30 code	R-PBGA-B143
memory density	16777216 bit
Memory IC Type	SRAM MODULE
memory width	32
Number of functions	1
Number of terminals	143
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512KX32
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA143,12X12,50
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
Maximum standby current	0.12 A
Minimum standby current	3 V
Maximum slew rate	0.4 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED

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Description	SRAM Module, 512KX32, 20ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143	SRAM Module, 512KX32, 17ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143	SRAM Module, 512KX32, 17ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143	SRAM Module, 512KX32, 15ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143	SRAM Module, 512KX32, 20ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143	SRAM Module, 512KX32, 12ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143	SRAM Module, 512KX32, 20ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143	SRAM Module, 512KX32, 15ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143	SRAM Module, 512KX32, 17ns, CMOS, PBGA143, 16 X 18 MM, PLASTIC, BGA-143
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	16 X 18 MM, PLASTIC, BGA-143	BGA, BGA143,12X12,50	BGA, BGA143,12X12,50	16 X 18 MM, PLASTIC, BGA-143	16 X 18 MM, PLASTIC, BGA-143	16 X 18 MM, PLASTIC, BGA-143	16 X 18 MM, PLASTIC, BGA-143	16 X 18 MM, PLASTIC, BGA-143	16 X 18 MM, PLASTIC, BGA-143
Contacts	143	143	143	143	143	143	143	143	143
Reach Compliance Code	unknown	compliant	compliant	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A001.A.2.C	3A991.B.2.A	3A991.B.2.A	3A001.A.2.C	3A001.A.2.C
Maximum access time	20 ns	17 ns	17 ns	15 ns	20 ns	12 ns	20 ns	15 ns	17 ns
Other features	ALSO CONFIGURABLE AS 2M X 8	ALSO CONFIGURABLE AS 2M X 8	ALSO CONFIGURABLE AS 2M X 8	ALSO CONFIGURABLE AS 2M X 8	ALSO CONFIGURABLE AS 2M X 8	ALSO CONFIGURABLE AS 2M X 8	ALSO CONFIGURABLE AS 2M X 8	ALSO CONFIGURABLE AS 2M X 8	ALSO CONFIGURABLE AS 2M X 8
Spare memory width	16	16	16	16	16	16	16	16	16
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PBGA-B143	R-PBGA-B143	R-PBGA-B143	R-PBGA-B143	R-PBGA-B143	R-PBGA-B143	R-PBGA-B143	R-PBGA-B143	R-PBGA-B143
memory density	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit	16777216 bit
Memory IC Type	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE
memory width	32	32	32	32	32	32	32	32	32
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	143	143	143	143	143	143	143	143	143
word count	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000	512000	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	85 °C	70 °C	125 °C	70 °C	70 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-	-40 °C	-	-55 °C	-	-	-55 °C	-55 °C
organize	512KX32	512KX32	512KX32	512KX32	512KX32	512KX32	512KX32	512KX32	512KX32
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
Encapsulate equivalent code	BGA143,12X12,50	BGA143,12X12,50	BGA143,12X12,50	BGA143,12X12,50	BGA143,12X12,50	BGA143,12X12,50	BGA143,12X12,50	BGA143,12X12,50	BGA143,12X12,50
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.12 A	0.12 A	0.12 A	0.12 A	0.12 A	0.12 A	0.12 A	0.12 A	0.12 A
Minimum standby current	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Maximum slew rate	0.4 mA	0.4 mA	0.4 mA	0.4 mA	0.4 mA	0.4 mA	0.4 mA	0.4 mA	0.4 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL	MILITARY	MILITARY
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Maker	Microsemi	-	-	Microsemi	Microsemi	Microsemi	Microsemi	Microsemi	Microsemi

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