LG226D473MAT2S1 datasheet, PDF

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LG226D473MAT2S1: DescriptionCeramic Capacitor, Multilayer, Ceramic, 6.3V, 20% +Tol, 20% -Tol, X5R, 15% TC, 0.047uF, Surface Mount, 0306, CHIP, ROHS COMPLIANT; CategoryPassive components capacitor; File Size365KB，4 Pages; ManufacturerAVX; Environmental Compliance

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LG226D473MAT2S1 Overview

Ceramic Capacitor, Multilayer, Ceramic, 6.3V, 20% +Tol, 20% -Tol, X5R, 15% TC, 0.047uF, Surface Mount, 0306, CHIP, ROHS COMPLIANT

LG226D473MAT2S1 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Objectid	1671144888
package instruction	, 0306
Reach Compliance Code	compliant
ECCN code	EAR99
YTEOL	8.4
capacitance	0.047 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	0.5 mm
JESD-609 code	e3
length	0.76 mm
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	20%
Number of terminals	2
Maximum operating temperature	85 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Package form	SMT
method of packing	TR, 7 INCH
positive tolerance	20%
Rated (DC) voltage (URdc)	6.3 V
size code	0306
surface mount	YES
Temperature characteristic code	X5R
Temperature Coefficient	15% ppm/°C
Terminal surface	TIN
Terminal shape	WRAPAROUND
width	1.6 mm

LG226D473MAT2S1 Preview

Low Inductance Capacitors

Introduction

The signal integrity characteristics of a Power Delivery

Network (PDN) are becoming critical aspects of board level

and semiconductor package designs due to higher operating

frequencies, larger power demands, and the ever shrinking

lower and upper voltage limits around low operating voltages.

These power system challenges are coming from mainstream

designs with operating frequencies of 300MHz or greater,

modest ICs with power demand of 15 watts or more, and

operating voltages below 3 volts.

The classic PDN topology is comprised of a series of

capacitor stages. Figure 1 is an example of this architecture

with multiple capacitor stages.

An ideal capacitor can transfer all its stored energy to a load

instantly. A real capacitor has parasitics that prevent

instantaneous transfer of a capacitor’s stored energy. The

true nature of a capacitor can be modeled as an RLC

equivalent circuit. For most simulation purposes, it is possible

to model the characteristics of a real capacitor with one

Slowest Capacitors

capacitor, one resistor, and one inductor. The RLC values in

this model are commonly referred to as equivalent series

capacitance (ESC), equivalent series resistance (ESR), and

equivalent series inductance (ESL).

The ESL of a capacitor determines the speed of energy

transfer to a load. The lower the ESL of a capacitor, the faster

that energy can be transferred to a load. Historically, there

has been a tradeoff between energy storage (capacitance)

and inductance (speed of energy delivery). Low ESL devices

typically have low capacitance. Likewise, higher capacitance

devices typically have higher ESLs. This tradeoff between

ESL (speed of energy delivery) and capacitance (energy

storage) drives the PDN design topology that places the

fastest low ESL capacitors as close to the load as possible.

Low Inductance MLCCs are found on semiconductor

packages and on boards as close as possible to the load.

Fastest Capacitors

Semiconductor Product

Bulk

Board-Level

Package-Level

Die-Level

Low Inductance Decoupling Capacitors

Figure 1 Classic Power Delivery Network (PDN) Architecture

LOW INDUCTANCE CHIP CAPACITORS

The key physical characteristic determining equivalent series

inductance (ESL) of a capacitor is the size of the current loop

it creates. The smaller the current loop, the lower the ESL. A

standard surface mount MLCC is rectangular in shape with

electrical terminations on its shorter sides. A Low Inductance

Chip Capacitor (LICC) sometimes referred to as Reverse

Geometry Capacitor (RGC) has its terminations on the longer

side of its rectangular shape.

When the distance between terminations is reduced, the size

of the current loop is reduced. Since the size of the current

loop is the primary driver of inductance, an 0306 with a

smaller current loop has significantly lower ESL then an 0603.

The reduction in ESL varies by EIA size, however, ESL is

typically reduced 60% or more with an LICC versus a

standard MLCC.

INTERDIGITATED CAPACITORS

The size of a current loop has the greatest impact on the ESL

characteristics of a surface mount capacitor. There is a

secondary method for decreasing the ESL of a capacitor.

This secondary method uses adjacent opposing current

loops to reduce ESL. The InterDigitated Capacitor (IDC)

utilizes both primary and secondary methods of reducing

inductance. The IDC architecture shrinks the distance

between terminations to minimize the current loop size, then

further reduces inductance by creating adjacent opposing

current loops.

An IDC is one single capacitor with an internal structure that

has been optimized for low ESL. Similar to standard MLCC

versus LICCs, the reduction in ESL varies by EIA case size.

Typically, for the same EIA size, an IDC delivers an ESL that

is at least 80% lower than an MLCC.

Low Inductance Capacitors

Introduction

LAND GRID ARRAY (LGA) CAPACITORS

Land Grid Array (LGA) capacitors are based on the first Low

ESL MLCC technology created to specifically address the

design needs of current day Power Delivery Networks (PDNs).

This is the 3rd low inductance capacitor technology

developed by AVX. LGA technology provides engineers with

new options. The LGA internal structure and manufacturing

technology eliminates the historic need for a device to be

physically small to create small current loops to minimize

inductance.

The first family of LGA products are 2 terminal devices. A

2 terminal 0306 LGA delivers ESL performance that is equal

to or better than an 0306 8 terminal IDC. The 2 terminal 0805

LGA delivers ESL performance that approaches the 0508

8 terminal IDC. New designs that would have used 8 terminal

IDCs are moving to 2 terminal LGAs because the layout is

easier for a 2 terminal device and manufacturing yield is better

for a 2 terminal LGA versus an 8 terminal IDC.

LGA technology is also used in a 4 terminal family of products

that AVX is sampling and will formerly introduce in 2008.

Beyond 2008, there are new multi-terminal LGA product

families that will provide even more attractive options for PDN

designers.

LOW INDUCTANCE CHIP ARRAYS (LICA

)

The LICA

product family is the result of a joint development

effort between AVX and IBM to develop a high performance

MLCC family of decoupling capacitors. LICA was introduced

in the 1980s and remains the leading choice of designers in

high performance semiconductor packages and high

reliability board level decoupling applications.

LICA

products are used in 99.999% uptime semiconductor

package applications on both ceramic and organic

substrates. The C4 solder ball termination option is the

perfect compliment to flip-chip packaging technology.

Mainframe class CPUs, ultimate performance multi-chip

modules, and communications systems that must have the

reliability of 5 9’s use LICA

LICA

products with either Sn/Pb or Pb-free solder balls are

used for decoupling in high reliability military and aerospace

applications. These LICA

devices are used for decoupling of

large pin count FPGAs, ASICs, CPUs, and other high power

ICs with low operating voltages.

When high reliability decoupling applications require the very

lowest ESL capacitors, LICA

products are the best option.

470 nF 0306 Impedance Comparison

0306 2T-LGA

0306 LICC

0306 8T-IDC

0603 MLCC

Impedance (ohms)

0.1

0.01

0.001

Frequency (MHz)

Figure 2 MLCC, LICC, IDC, and LGA technologies deliver different levels of equivalent series inductance (ESL).

100

1000

LGA Low Inductance Capacitors

0204/0306/0805 Land Grid Arrays

Land Grid Array (LGA) capacitors are the latest family of low inductance MLCCs from AVX.

These new LGA products are the third low inductance family developed by AVX. The in-

novative LGA technology sets a new standard for low inductance MLCC performance.

Electronic Products

awarded its 2006 Product of the Year Award to the LGA Decoupling

capacitor.

Our initial 2 terminal versions of LGA technology deliver the performance of an 8 terminal

IDC low inductance MLCC with a number of advantages including:

•

Simplified layout of 2 large solder pads compared to 8 small pads for IDCs

•

Opportunity to reduce PCB or substrate contribution to system ESL by using multi-

ple parallel vias in solder pads

•

Advanced FCT manufacturing process used to create uniformly flat terminations on

the capacitor that resist “tombstoning”

•

Better solder joint reliability

APPLICATIONS

Semiconductor Packages

•

Microprocessors/CPUs

•

Graphics Processors/GPUs

•

Chipsets

•

FPGAs

•

ASICs

Board Level Device Decoupling

•

Frequencies of 300 MHz or more

•

ICs drawing 15W or more

•

Low voltages

•

High speed buses

0306 2 TERMINAL LGA COMPARISON WITH 0306 8 TERMINAL IDC

Impedance (Ω)

0.1

0.01

0.001

100

1000

Frequency (MHz)

LGA Low Inductance Capacitors

0204/0306/0805 Land Grid Arrays

SIZE

Length

mm (in.)

Width

mm (in.)

Temp. Char.

Working Voltage

Cap (µF)

0.010 (103)

0.022 (223)

0.047 (473)

0.100 (104)

0.220 (224)

0.330 (334)

0.470 (474)

1.000 (105)

2.200 (225)

X5R (D)

6.3

(6)

(4)

LG12 (0204)

0.50 (0.020)

1.00 (0.039)

X7S (Z)

6.3

(6)

(4)

X6S (W)

6.3

(6)

(4)

X7R (C)

6.3

(Z)

(6)

(4)

LG22 (0306)

0.76 (0.030)

1.60 (0.063)

X5R (D)

X7S (Z)

6.3

(6)

(4)

(6)

(4)

X6S (W)

6.3

(6)

(4)

X7R (C)

6.3

(6)

(4)

LGC2 (0805)

2.06 (0.081)

1.32 (0.052)

X5R (D)

X7S (Z)

6.3

(6)

(4)

(6)

(4)

X6S (W)

6.3

(6)

(4)

= X7R

= X5R

= X7S

= X6S

HOW TO ORDER

104

Style

Case Number of

Size

Terminals

1 = 0204

2 = 0306

C = 0805

Working Temperature Coded

Cap

Termination Termination

Voltage Characteristic Cap Tolerance

Style

100% Sn*

4 = 4V

C = X7R

M = 20% A = “U” Land

*Contact factory for

6 = 6.3V

D = X5R

other termination

Z = 10V

Z = X7S

finishes

W = X6S

Packaging

Thickness

Tape & Reel

S = 0.55mm

2 = 7" Reel

max

4 = 13" Reel

Number of

Capacitors

Reverse

Geometry LGA

LG12, LG22

Standard

Geometry LGA

LGC2

iew

Sid

PART DIMENSIONS

Series

LG12 (0204)

LG22 (0306)

LGC2 (0805)

mm (inches)

0.5 ± 0.05

(0.020±0.002)

0.76 ± 0.10

(0.030 ± 0.004)

2.06 ± 0.10

(0.081 ± 0.004)

1.00 ± 0.10

(0.039 ± 0.004)

1.60 ± 0.10

(0.063 ± 0.004)

1.32 ± 0.10

(0.052 ± 0.004)

0.50 ± 0.05

(0.020 ± 0.002)

0.50 ± 0.05

(0.020 ± 0.002)

0.50 ± 0.05

(0.020 ± 0.002)

0.8 ± 0.10

(0.031 ± 0.004)

1.50 ±0.10

(0.059 ± 0.004)

1.14 ± 0.10

(0.045 ± 0.004)

0.13 ± 0.08

(0.005 ± 0.003)

0.28 ± 0.08

(0.011 ± 0.003)

0.90 ±0.08

(0.035 ± 0.003)

RECOMMENDED SOLDER PAD DIMENSIONS

mm (inches)

Series

0.50 (0.020)

0.65 (0.026)

1.25 (0.049)

PW1

1.00 (0.039)

1.50 (0.059)

1.40 (0.055)

0.20 (0.008)

LEAD-FREE COMPATIBLE

COMPONENT

PW1

LG12 (0204)

LG22 (0306)

LGC2 (0805)

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package instruction	, 0306	, 0306	, 0306	, 0306	, 0306	, 0306	, 0306	, 0306	, 0306	, 0805
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compli
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
capacitance	0.047 µF	0.01 µF	0.047 µF	0.022 µF	0.01 µF	0.022 µF	0.01 µF	0.1 µF	0.22 µF	1 µF
Capacitor type	CERAMIC CAPACITOR	CERAMIC CAPACITOR	CERAMIC CAPACITOR	CERAMIC CAPACITOR	CERAMIC CAPACITOR	CERAMIC CAPACITOR	CERAMIC CAPACITOR	CERAMIC CAPACITOR	CERAMIC CAPACITOR	CERAMIC CAPACITOR
dielectric materials	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
JESD-609 code	e3	e3	e3	e3	e3	e3	e3	e3	e3	e3
Installation features	SURFACE MOUNT	SURFACE MOUNT	SURFACE MOUNT	SURFACE MOUNT	SURFACE MOUNT	SURFACE MOUNT	SURFACE MOUNT	SURFACE MOUNT	SURFACE MOUNT	SURFACE MOUNT
multi-layer	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
negative tolerance	20%	20%	20%	20%	20%	20%	20%	20%	20%	20%
Number of terminals	2	2	2	2	2	2	2	2	2	2
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	125 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
Package shape	RECTANGULAR PACKAGE	RECTANGULAR PACKAGE	RECTANGULAR PACKAGE	RECTANGULAR PACKAGE	RECTANGULAR PACKAGE	RECTANGULAR PACKAGE	RECTANGULAR PACKAGE	RECTANGULAR PACKAGE	RECTANGULAR PACKAGE	RECTANGULAR PACKAGE
method of packing	TR, 7 INCH	TR, 13 INCH	TR, 13 INCH	TR, 7 INCH	TR, 7 INCH	TR, 13 INCH	TR, 13 INCH	TR, 13 INCH	TR, 13 INCH	TR, 13 INCH
positive tolerance	20%	20%	20%	20%	20%	20%	20%	20%	20%	20%
Rated (DC) voltage (URdc)	6.3 V	6.3 V	6.3 V	6.3 V	6.3 V	6.3 V	6.3 V	6.3 V	6.3 V	6.3 V
size code	0306	0306	0306	0306	0306	0306	0306	0306	0306	0805
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
Temperature characteristic code	X5R	X5R	X5R	X5R	X5R	X5R	X7R	X5R	X5R	X5R
Temperature Coefficient	15% ppm/°C	15% ppm/°C	15% ppm/°C	15% ppm/°C	15% ppm/°C	15% ppm/°C	15% ppm/°C	15% ppm/°C	15% ppm/°C	15% ppm/°C
Terminal surface	TIN	TIN	TIN	TIN	TIN	TIN	TIN	TIN	TIN	Tin (Sn)
Terminal shape	WRAPAROUND	WRAPAROUND	WRAPAROUND	WRAPAROUND	WRAPAROUND	WRAPAROUND	WRAPAROUND	WRAPAROUND	WRAPAROUND	WRAPAROUND
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	-	Lead free	-	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	-	conform to	-	conform to
Objectid	1671144888	1671144879	1671144889	1671144884	1671144878	1671144885	-	1671144881	1671144887	-
YTEOL	8.4	8.4	8.4	8.4	8.4	8.4	-	8.4	8.4	-
high	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	-	0.5 mm	0.5 mm	-
length	0.76 mm	0.76 mm	0.76 mm	0.76 mm	0.76 mm	0.76 mm	-	0.76 mm	0.76 mm	-
Package form	SMT	SMT	SMT	SMT	SMT	SMT	-	SMT	SMT	-
width	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	-	1.6 mm	1.6 mm	-

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