M38510/13501SGA datasheet, PDF

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M38510/13501SGA: DescriptionOperational Amplifier, 1 Func, 60uV Offset-Max, BIPolar, MBCY8,; CategoryAnalog mixed-signal IC Amplifier circuit; File Size240KB，28 Pages; ManufacturerPrecision Monolithics Inc

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M38510/13501SGA Overview

Operational Amplifier, 1 Func, 60uV Offset-Max, BIPolar, MBCY8,

M38510/13501SGA Parametric

Parameter Name	Attribute value
Maker	Precision Monolithics Inc
Reach Compliance Code	unknown

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INCH-POUND

MIL-M-38510/135D

01 June 2005

SUPERSEDING

MIL-M-38510/135C

05 November 2003

MILITARY SPECIFICATION

MICROCIRCUITS, LINEAR, LOW OFFSET OPERATIONAL AMPLIFIERS, MONOLITHIC SILICON

This specification is approved for use by all Departments and Agencies of the Department of Defense.

Reactivated for new design as of 05 November 2003. May be used for either new or existing design acquisition.

The requirement for acquiring the product herein shall consist of this specification sheet and MIL-PRF-38535.

1. SCOPE

1.1 Scope. This specification covers the detail requirements for monolithic silicon, low offset operational

amplifiers. Two product assurance classes and a choice of case outlines and lead finishes are provided and are

reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by

MIL-PRF-38535, (see 6.4)

1.2 Part or identifying Number (PIN). The PIN is in accordance with MIL-PRF-38535, and as specified herein.

1.2.1 Device types. Devices may be monolithic or they may consist of two separate independent die. The device

types are as follows:

Device type

Circuit

Single operational amplifier, ultra low offset, internally compensated

Single operational amplifier, low offset, internally compensated

Single operational amplifier, ultra low offset, internally compensated,

ultra low noise

Dual operational amplifier, low offset, ultra low noise internally

compensated

Single operational amplifier, ultra low offset, internally compensated,

ultra low noise, broadband

1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535.

1.2.3 Case outline. The case outline are as designated in MIL-STD-1835 and as follows:

Outline letter

Descriptive designator

GDIP1-T14 or CDIP2-T14

MACY1-X8

GDIP1-T8 or CDIP2-T8

CQCC1-N20

Terminals

Package style

Dual-in-line

Can

Dual-in-line

Square leadless chip carrier

Comments, suggestions, or questions on this document should be addressed to: Commander, Defense

Supply Center Columbus, ATTN: DSCC-VAS, 3990 East Broad St., Columbus, OH 43216-5000, or emailed

linear@dscc.dla.mil

. Since contact information can change, you may want to verify the currency of this

address information using the ASSIST Online database at

http://assist.daps.dla.mil

AMSC N/A

FSC 5962

MIL-M-38510/135D

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883

MIL-STD-1835

- Test Method Standard for Microelectronics.

- Interface Standard Electronic Component Case Outlines.

(Copies of these documents are available online at

http://assist.daps.dla.mil/quicksearch/

http://assist.daps.dla.mil

or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,

Philadelphia, PA 19111-5094.)

2.3 Order of precedence. In the event of a conflict between the text of this specification and the references cited

herein the text of this document shall take precedence. Nothing in this document, however, supersedes applicable

laws and regulations unless a specific exemption has been obtained.

3. REQUIREMENTS

3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a

manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before

contract award (see 4.3 and 6.3).

3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as

specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the

QM plan shall not affect the form, fit, or function as described herein.

3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as

specified in MIL-PRF-38535 and herein.

3.3.1 Circuit diagram and terminal connections. The circuit diagram and terminal connections shall be as specified

on figure 1.

3.3.2 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to

the qualifying activity and the preparing activity upon request.

3.3.3 Case outlines. The case outlines shall be as specified in 1.2.3.

3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).

3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table I,

and unless otherwise specified, apply over the full recommended ambient operating temperature range for supply

voltages from

±4.5

V dc to

±20

V dc for device types 01 and 02 and for supply voltages from

±4.5

V dc to

±18

V dc for

device types 03, 04, and 05. Unless otherwise specified, source resistance (R

) shall be 50 ohms for all tests.

3.5.1 Offset null circuits. The nulling inputs shall be capable of being nulled 0.5 mV beyond the specified offset

voltage limits for –55°C

≤

125°C using the circuit of figure 2.

3.5.2 Instability oscillations. The devices shall be free of oscillations when operated in the test circuits

of this specification.

3.6 Electrical test requirements. Electrical test requirements for each device class shall be the subgroups

specified in table II. The electrical tests for each subgroup are described in table III.

3.7 Marking. Marking shall be in accordance with MIL-PRF-38535.

3.8 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group

number 49 (see MIL-PRF-38535, appendix A).

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