Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
wire
encapsulation
BGA 728L7 E6327
MA000505226
PG-TSLP-7-1
Material Group
inorganic material
non noble metal
noble metal
inorganic material
organic material
plastics
inorganic material
noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
nickel
gold
antimonytrioxide
carbon black
epoxy resin
silicondioxide
gold
gold
epoxy resin
silver
CAS#
if applicable
7440-21-3
7440-02-0
7440-57-5
1309-64-4
1333-86-4
-
60676-86-0
7440-57-5
7440-57-5
-
7440-22-4
Issued
Weight*
Weight
[mg]
0.147
0.329
0.043
0.000
0.010
0.128
0.813
0.032
0.032
0.016
0.066
Average
Mass
[%]
9.12
20.34
2.69
0.03
0.59
7.95
50.27
1.96
1.96
1.02
4.07
30. January 2015
1.62 mg
Sum
[%]
9.12
20.34
2.69
Average
Mass
[ppm]
91165
203415
26853
294
5886
79455
58.84
1.96
1.96
502921
19573
19573
10173
5.09
40692
50865
1000000
588556
19573
19573
Sum
[ppm]
91165
203415
26853
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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