EDI8F2432C30MZC datasheet, PDF

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EDI8F2432C30MZC: DescriptionSRAM Module, 32KX24, 30ns, CMOS, MODULE, ZIP-56; Categorystorage storage; File Size307KB，6 Pages; ManufacturerEDI [Electronic devices inc.]

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EDI8F2432C30MZC Overview

SRAM Module, 32KX24, 30ns, CMOS, MODULE, ZIP-56

EDI8F2432C30MZC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	EDI [Electronic devices inc.]
package instruction	MODULE, ZIP-56
Reach Compliance Code	unknown
Maximum access time	30 ns
I/O type	COMMON
JESD-30 code	R-XZMA-T56
JESD-609 code	e0
memory density	786432 bit
Memory IC Type	SRAM MODULE
memory width	24
Number of functions	1
Number of ports	1
Number of terminals	56
word count	32768 words
character code	32000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32KX24
Output characteristics	3-STATE
Exportable	YES
Package body material	UNSPECIFIED
encapsulated code	ZIP
Encapsulate equivalent code	ZIP56,.1,.1
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum standby current	0.045 A
Minimum standby current	4.5 V
Maximum slew rate	0.5 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	1.27 mm
Terminal location	ZIG-ZAG
Maximum time at peak reflow temperature	NOT SPECIFIED

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EDI8F2432C30MZC Related Products

	EDI8F2432C30MZC	EDI8F2432C25MZC	EDI8F2432C35MZC	EDI8F2432C55MZC	EDI8F2432C45MZC
Description	SRAM Module, 32KX24, 30ns, CMOS, MODULE, ZIP-56	SRAM Module, 32KX24, 25ns, CMOS,	SRAM Module, 32KX24, 35ns, CMOS,	SRAM Module, 32KX24, 55ns, CMOS, MODULE, ZIP-56	SRAM Module, 32KX24, 45ns, CMOS, MODULE, ZIP-56
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]	EDI [Electronic devices inc.]
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
Maximum access time	30 ns	25 ns	35 ns	55 ns	45 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XZMA-T56	R-XZMA-T56	R-XZMA-T56	R-XZMA-T56	R-XZMA-T56
JESD-609 code	e0	e0	e0	e0	e0
memory density	786432 bit	786432 bit	786432 bit	786432 bit	786432 bit
Memory IC Type	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE
memory width	24	24	24	24	24
Number of functions	1	1	1	1	1
Number of ports	1	1	1	1	1
Number of terminals	56	56	56	56	56
word count	32768 words	32768 words	32768 words	32768 words	32768 words
character code	32000	32000	32000	32000	32000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C
organize	32KX24	32KX24	32KX24	32KX24	32KX24
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES	YES
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	ZIP	ZIP	ZIP	ZIP	ZIP
Encapsulate equivalent code	ZIP56,.1,.1	ZIP56,.1,.1	ZIP56,.1,.1	ZIP56,.1,.1	ZIP56,.1,.1
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.045 A	0.045 A	0.045 A	0.045 A	0.045 A
Minimum standby current	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Maximum slew rate	0.5 mA	0.5 mA	0.5 mA	0.5 mA	0.5 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG
package instruction	MODULE, ZIP-56	-	-	MODULE, ZIP-56	MODULE, ZIP-56
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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