SRAM Module, 32KX24, 35ns, CMOS,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | EDI [Electronic devices inc.] |
| Reach Compliance Code | unknown |
| Maximum access time | 35 ns |
| I/O type | COMMON |
| JESD-30 code | R-XZMA-T56 |
| JESD-609 code | e0 |
| memory density | 786432 bit |
| Memory IC Type | SRAM MODULE |
| memory width | 24 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 56 |
| word count | 32768 words |
| character code | 32000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 32KX24 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | UNSPECIFIED |
| encapsulated code | ZIP |
| Encapsulate equivalent code | ZIP56,.1,.1 |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.045 A |
| Minimum standby current | 4.5 V |
| Maximum slew rate | 0.5 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 1.27 mm |
| Terminal location | ZIG-ZAG |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Base Number Matches | 1 |
| EDI8F2432C35MZC | EDI8F2432C25MZC | EDI8F2432C55MZC | EDI8F2432C45MZC | EDI8F2432C30MZC | |
|---|---|---|---|---|---|
| Description | SRAM Module, 32KX24, 35ns, CMOS, | SRAM Module, 32KX24, 25ns, CMOS, | SRAM Module, 32KX24, 55ns, CMOS, MODULE, ZIP-56 | SRAM Module, 32KX24, 45ns, CMOS, MODULE, ZIP-56 | SRAM Module, 32KX24, 30ns, CMOS, MODULE, ZIP-56 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | 35 ns | 25 ns | 55 ns | 45 ns | 30 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-XZMA-T56 | R-XZMA-T56 | R-XZMA-T56 | R-XZMA-T56 | R-XZMA-T56 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| memory density | 786432 bit | 786432 bit | 786432 bit | 786432 bit | 786432 bit |
| Memory IC Type | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| memory width | 24 | 24 | 24 | 24 | 24 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 56 | 56 | 56 | 56 | 56 |
| word count | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| character code | 32000 | 32000 | 32000 | 32000 | 32000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 32KX24 | 32KX24 | 32KX24 | 32KX24 | 32KX24 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Exportable | YES | YES | YES | YES | YES |
| Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| encapsulated code | ZIP | ZIP | ZIP | ZIP | ZIP |
| Encapsulate equivalent code | ZIP56,.1,.1 | ZIP56,.1,.1 | ZIP56,.1,.1 | ZIP56,.1,.1 | ZIP56,.1,.1 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.045 A | 0.045 A | 0.045 A | 0.045 A | 0.045 A |
| Minimum standby current | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Maximum slew rate | 0.5 mA | 0.5 mA | 0.5 mA | 0.5 mA | 0.5 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| package instruction | - | - | MODULE, ZIP-56 | MODULE, ZIP-56 | MODULE, ZIP-56 |
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