|
MBM29F040A-12PD-X |
MBM29F040A-90PFTR-X |
MBM29F040A-12PFTN-X |
MBM29F040A-90PD-X |
Description |
512KX8 FLASH 5V PROM, 120ns, PQCC32, PLASTIC, LCC-32 |
Flash, 512KX8, 90ns, PDSO32, PLASTIC, REVERSE, TSOP-32 |
512KX8 FLASH 5V PROM, 120ns, PDSO32, PLASTIC, TSOP-32 |
Flash, 512KX8, 90ns, PQCC32, PLASTIC, LCC-32 |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
incompatible |
package instruction |
QCCJ, LDCC32,.5X.6 |
PLASTIC, REVERSE, TSOP-32 |
TSOP1, TSSOP32,.8,20 |
PLASTIC, LCC-32 |
Reach Compliance Code |
unknown |
unknown |
unknown |
unknown |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Maximum access time |
120 ns |
90 ns |
120 ns |
90 ns |
Other features |
MINIMUM 100000 WRITE/ERASE CYCLES; AUTOMATIC WRITE |
MINIMUM 100000 WRITE/ERASE CYCLES; AUTOMATIC WRITE |
MINIMUM 100000 WRITE/ERASE CYCLES; AUTOMATIC WRITE |
MINIMUM 100000 WRITE/ERASE CYCLES; AUTOMATIC WRITE |
command user interface |
YES |
YES |
YES |
YES |
Data polling |
YES |
YES |
YES |
YES |
Durability |
100000 Write/Erase Cycles |
100000 Write/Erase Cycles |
100000 Write/Erase Cycles |
100000 Write/Erase Cycles |
JESD-30 code |
R-PQCC-J32 |
R-PDSO-G32 |
R-PDSO-G32 |
R-PQCC-J32 |
JESD-609 code |
e0 |
e0 |
e0 |
e0 |
length |
13.97 mm |
18.4 mm |
18.4 mm |
13.97 mm |
memory density |
4194304 bit |
4194304 bit |
4194304 bit |
4194304 bit |
Memory IC Type |
FLASH |
FLASH |
FLASH |
FLASH |
memory width |
8 |
8 |
8 |
8 |
Number of functions |
1 |
1 |
1 |
1 |
Number of departments/size |
8 |
8 |
8 |
8 |
Number of terminals |
32 |
32 |
32 |
32 |
word count |
524288 words |
524288 words |
524288 words |
524288 words |
character code |
512000 |
512000 |
512000 |
512000 |
Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
ASYNCHRONOUS |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
organize |
512KX8 |
512KX8 |
512KX8 |
512KX8 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
QCCJ |
TSOP1-R |
TSOP1 |
QCCJ |
Encapsulate equivalent code |
LDCC32,.5X.6 |
TSSOP32,.8,20 |
TSSOP32,.8,20 |
LDCC32,.5X.6 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
CHIP CARRIER |
SMALL OUTLINE, THIN PROFILE |
SMALL OUTLINE, THIN PROFILE |
CHIP CARRIER |
Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
PARALLEL |
Programming voltage |
5 V |
5 V |
5 V |
5 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
3.56 mm |
1.2 mm |
1.2 mm |
3.56 mm |
Department size |
64K |
64K |
64K |
64K |
Maximum standby current |
0.0001 A |
0.0001 A |
0.0001 A |
0.0001 A |
Maximum slew rate |
0.08 mA |
0.08 mA |
0.08 mA |
0.08 mA |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
surface mount |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
TIN LEAD |
Tin/Lead (Sn/Pb) |
TIN LEAD |
Tin/Lead (Sn/Pb) |
Terminal form |
J BEND |
GULL WING |
GULL WING |
J BEND |
Terminal pitch |
1.27 mm |
0.5 mm |
0.5 mm |
1.27 mm |
Terminal location |
QUAD |
DUAL |
DUAL |
QUAD |
switch bit |
YES |
YES |
YES |
YES |
type |
NOR TYPE |
NOR TYPE |
NOR TYPE |
NOR TYPE |
width |
11.43 mm |
8 mm |
8 mm |
11.43 mm |