F-213
QSS–075–01–F–D–A
QSS–050–01–F–D–A
®
(0,635 mm) .025"
QSS SERIES
QSS–025–01–L–D–A
HIGH SPEED GROUND PLANE SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QSS
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50µ" (1,27 µm) Ni
Current Rating:
Contact: 1.1A per contact
@ 30°C Temperature Rise
Ground Plane: 7.8A per ground
plane@ 30°C Temperature Rise
Operating Temp:
-55°C to +125°C
Voltage Rating:
285 VAC
Max Cycles:
100
RoHS Compliant:
Yes
Board Mates:
QTS
Cable Mates:
SQCD
Integral metal plane
for power or ground
Polarized
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Processing:
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (025-050)
(0,15 mm) .006" max (075)
Board Stacking:
For applications requiring more
than two connectors per board
contact ipg@samtec.com
QSS/QTS
Type
Rated @ 3dB Insertion Loss*
5 mm Stack Height
Single-Ended Signaling
–D
9 GHz / 18 Gbps
Differential Pair Signaling
–D
8.5 GHz / 17 Gbps
Differential Pair Signaling –DP
8.5 GHz / 17 Gbps
*Performance data includes effects of a non-optimized PCB.
Performance data for other stack heights and complete
test data available at www.samtec.com?QSS or contact
sig@samtec.com
Alignment
Pin
TM
Blade & Beam
Design
EXTENDED LIFE PRODUCT
10 year Mixed Flowing Gas with 50µ" Gold
Call Samtec for maximum cycles mated with QTS
QSS
NO. OF POSITIONS
PER ROW
01
PLATING
OPTION
D
A
OTHER
OPTION
APPLICATION
SPECIFIC OPTION
• 11 mm & 16 mm
stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please consult
machinery specifications.)
• 30µ" (0,76 µm) Gold
• Differential Pair and
“Partitionable” (combine
differential & single-ended
banks in same connector)
available.
• 100 & 125 positions per row
• Edge Mount
• –LS2 Locking screw hole
for QTS–RA–LS2
Call Samtec.
–025, –050, –075
(50 total positions per bank)
–F
= Gold Flash on Signal Pins and
Ground Plane, Matte Tin on tails
–GP
= Guide Holes
for mating
with QTS-RA
–L
= 10µ" (0,25 µm) Gold on Signal Pins
and Ground Plane, Matte Tin on tails
–K
= (8,25 mm)
.325" DIA
Polyimide Film
Pick &
Place Pad
02
(No. of Positions per Row/25) x
(20,00) .7875 + (1,27) .050
(20,00) .7875
–C*
= Electro-Polished Selective
50µ" (1,27 µm) min Au over 150µ" (3,81 µm)
Ni on Signal Pins in contact area,
(7,49)
10µ" (0,25 µm) min Au over 50µ" (1,27 µm) Ni
.295
on Ground Plane in contact area, Matte Tin
over 50µ" (1,27 µm) min Ni on all solder tails
–TR
= Tape and
Reel
01
(3,63)
.143
(0,635)
.025
(0,15)
.006
(7,24)
.285
(0,76)
.030
02
(No. of Positions per Row/25) x
(20,00) .7875 + (10,90) .429
(0,89)
.035
DIA
ALSO AVAILABLE
• Board spacing
standoffs
(See SO Series)
*Note:
–C Plating passes
10 year MFG testing
Note:
Some lengths, styles
and options are non-standard,
non-returnable.
01
(No. of Positions per Row/25) x
(20,00) .7875 + (5,72) .225
(3,56)
.140
DIA
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