|
ST6X86P166+HS |
ST6X86P90+HS |
ST6X86P133+HS |
ST6X86P120+HS |
ST6X86P150+HS |
Description |
64-BIT, 133MHz, MICROPROCESSOR, CPGA296, CERAMIC, PGA-296 |
64-BIT, 80MHz, MICROPROCESSOR, CPGA296, CERAMIC, PGA-296 |
64-BIT, 110MHz, MICROPROCESSOR, CPGA296, CERAMIC, PGA-296 |
64-BIT, 100MHz, MICROPROCESSOR, CPGA296, CERAMIC, PGA-296 |
64-BIT, 120MHz, MICROPROCESSOR, CPGA296, CERAMIC, PGA-296 |
Parts packaging code |
PGA |
PGA |
PGA |
PGA |
PGA |
package instruction |
CERAMIC, PGA-296 |
IPGA, |
CERAMIC, PGA-296 |
CERAMIC, PGA-296 |
CERAMIC, PGA-296 |
Contacts |
296 |
296 |
296 |
296 |
296 |
Reach Compliance Code |
not_compliant |
unknow |
not_compliant |
not_compliant |
not_compliant |
ECCN code |
3A001.A.3 |
3A991.A.2 |
3A001.A.3 |
3A001.A.3 |
3A001.A.3 |
Address bus width |
32 |
32 |
32 |
32 |
32 |
bit size |
64 |
64 |
64 |
64 |
64 |
boundary scan |
NO |
NO |
NO |
NO |
NO |
maximum clock frequency |
66.66 MHz |
40 MHz |
55.55 MHz |
50 MHz |
59.98 MHz |
External data bus width |
64 |
64 |
64 |
64 |
64 |
Format |
FLOATING POINT |
FLOATING POINT |
FLOATING POINT |
FLOATING POINT |
FLOATING POINT |
Integrated cache |
YES |
YES |
YES |
YES |
YES |
JESD-30 code |
S-CPGA-P296 |
S-CPGA-P296 |
S-CPGA-P296 |
S-CPGA-P296 |
S-CPGA-P296 |
length |
49.595 mm |
49.595 mm |
49.595 mm |
49.595 mm |
49.595 mm |
low power mode |
YES |
YES |
YES |
YES |
YES |
Number of terminals |
296 |
296 |
296 |
296 |
296 |
Maximum operating temperature |
70 °C |
70 °C |
70 °C |
70 °C |
70 °C |
Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
encapsulated code |
IPGA |
IPGA |
IPGA |
IPGA |
IPGA |
Package shape |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
Package form |
GRID ARRAY, INTERSTITIAL PITCH |
GRID ARRAY, INTERSTITIAL PITCH |
GRID ARRAY, INTERSTITIAL PITCH |
GRID ARRAY, INTERSTITIAL PITCH |
GRID ARRAY, INTERSTITIAL PITCH |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
4.7 mm |
4.7 mm |
4.7 mm |
4.7 mm |
4.7 mm |
speed |
133 MHz |
80 MHz |
110 MHz |
100 MHz |
120 MHz |
Maximum supply voltage |
3.7 V |
3.7 V |
3.7 V |
3.7 V |
3.7 V |
Minimum supply voltage |
3.15 V |
3.15 V |
3.15 V |
3.15 V |
3.15 V |
Nominal supply voltage |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
surface mount |
NO |
NO |
NO |
NO |
NO |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
Terminal form |
PIN/PEG |
PIN/PEG |
PIN/PEG |
PIN/PEG |
PIN/PEG |
Terminal pitch |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
2.54 mm |
Terminal location |
PERPENDICULAR |
PERPENDICULAR |
PERPENDICULAR |
PERPENDICULAR |
PERPENDICULAR |
width |
49.595 mm |
49.595 mm |
49.595 mm |
49.595 mm |
49.595 mm |
uPs/uCs/peripheral integrated circuit type |
MICROPROCESSOR |
MICROPROCESSOR |
MICROPROCESSOR |
MICROPROCESSOR |
MICROPROCESSOR |
Is it lead-free? |
Contains lead |
- |
Contains lead |
Contains lead |
Contains lead |
Is it Rohs certified? |
incompatible |
- |
incompatible |
incompatible |
incompatible |
Maker |
STMicroelectronics |
- |
STMicroelectronics |
STMicroelectronics |
STMicroelectronics |
JESD-609 code |
e0 |
- |
e0 |
e0 |
e0 |
Encapsulate equivalent code |
SPGA296,37X37 |
- |
SPGA296,37X37 |
SPGA296,37X37 |
SPGA296,37X37 |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
power supply |
3.3 V |
- |
3.3 V |
3.3 V |
3.3 V |
Maximum slew rate |
6600 mA |
- |
5800 mA |
5400 mA |
6100 mA |
Terminal surface |
Tin/Lead (Sn/Pb) |
- |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
- |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |