MPC8555PXAPDX datasheet, PDF - EEWORLD Datasheet

MPC8555PXAPDX: Description32-BIT, 833MHz, RISC PROCESSOR, PBGA783, 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，88 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MPC8555PXAPDX Overview

32-BIT, 833MHz, RISC PROCESSOR, PBGA783, 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783

Parameter Name	Attribute value
Maker	NXP
Parts packaging code	BGA
package instruction	BGA,
Contacts	783
Reach Compliance Code	unknown
ECCN code	3A001.A.3
Address bus width	64
bit size	32
boundary scan	YES
maximum clock frequency	166 MHz
External data bus width	64
Format	FLOATING POINT
Integrated cache	YES
JESD-30 code	S-PBGA-B783
length	29 mm
low power mode	YES
Number of terminals	783
Maximum operating temperature	105 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Certification status	Not Qualified
Maximum seat height	3.75 mm
speed	833 MHz
Maximum supply voltage	1.26 V
Minimum supply voltage	1.14 V
Nominal supply voltage	1.2 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
width	29 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

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