J-K Flip-Flop, 2-Func, Negative Edge Triggered, CMOS, CDIP14,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | LG Semicon Co., Ltd. |
package instruction | DIP, DIP14,.3 |
Reach Compliance Code | unknown |
JESD-30 code | R-XDIP-T14 |
JESD-609 code | e0 |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | J-K FLIP-FLOP |
Maximum Frequency@Nom-Sup | 25000000 Hz |
MaximumI(ol) | 0.004 A |
Number of functions | 2 |
Number of terminals | 14 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP14,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 2/6 V |
Certification status | Not Qualified |
surface mount | NO |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Trigger type | NEGATIVE EDGE |
GD74HC113J | GD54HC113J | GD54HCT113J | GD74HC113 | GD74HC113D | GD74HCT113D | GD74HCT113J | GD74HCT113 | |
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Description | J-K Flip-Flop, 2-Func, Negative Edge Triggered, CMOS, CDIP14, | J-K Flip-Flop, 2-Func, Negative Edge Triggered, CMOS, CDIP14, | J-K Flip-Flop, 2-Func, Negative Edge Triggered, CMOS, CDIP14, | J-K Flip-Flop, 2-Func, Negative Edge Triggered, CMOS, PDIP14, | J-K Flip-Flop, 2-Func, Negative Edge Triggered, CMOS, PDSO14, | J-K Flip-Flop, 2-Func, Negative Edge Triggered, CMOS, PDSO14, | J-K Flip-Flop, 2-Func, Negative Edge Triggered, CMOS, CDIP14, | J-K Flip-Flop, 2-Func, Negative Edge Triggered, CMOS, PDIP14, |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | SOP, SOP14,.25 | SOP, SOP14,.25 | DIP, DIP14,.3 | DIP, DIP14,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 code | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-XDIP-T14 | R-PDIP-T14 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
Logic integrated circuit type | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP | J-K FLIP-FLOP |
Maximum Frequency@Nom-Sup | 25000000 Hz | 20000000 Hz | 18000000 Hz | 25000000 Hz | 25000000 Hz | 22000000 Hz | 22000000 Hz | 22000000 Hz |
MaximumI(ol) | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
Number of functions | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
Maximum operating temperature | 85 °C | 125 °C | 125 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -55 °C | -55 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
Package body material | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | DIP | DIP | SOP | SOP | DIP | DIP |
Encapsulate equivalent code | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | SOP14,.25 | SOP14,.25 | DIP14,.3 | DIP14,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE |
power supply | 2/6 V | 2/6 V | 5 V | 2/6 V | 2/6 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
surface mount | NO | NO | NO | NO | YES | YES | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Trigger type | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE | NEGATIVE EDGE |
Maker | LG Semicon Co., Ltd. | - | - | LG Semicon Co., Ltd. | LG Semicon Co., Ltd. | LG Semicon Co., Ltd. | LG Semicon Co., Ltd. | LG Semicon Co., Ltd. |