AS7C4096-15BI datasheet, PDF - EEWORLD Datasheet

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AS7C4096-15BI: DescriptionStandard SRAM, 512KX8, 15ns, CMOS, PBGA48, 7 X 11 MM, FBGA-48; Categorystorage storage; File Size154KB，10 Pages; ManufacturerALSC [Alliance Semiconductor Corporation]

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AS7C4096-15BI Overview

Standard SRAM, 512KX8, 15ns, CMOS, PBGA48, 7 X 11 MM, FBGA-48

AS7C4096-15BI Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	ALSC [Alliance Semiconductor Corporation]
Parts packaging code	BGA
package instruction	TFBGA, BGA48,6X8,30
Contacts	48
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	15 ns
I/O type	COMMON
JESD-30 code	R-PBGA-B48
JESD-609 code	e0
length	11 mm
memory density	4194304 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	48
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA48,6X8,30
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.02 A
Minimum standby current	4.5 V
Maximum slew rate	0.22 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7 mm

AS7C4096-15BI Related Products

	AS7C4096-15BI	AS7C34096-15BC	AS7C4096-15BC	AS7C4096-20BC	AS7C34096-12BI
Description	Standard SRAM, 512KX8, 15ns, CMOS, PBGA48, 7 X 11 MM, FBGA-48	Standard SRAM, 512KX8, 15ns, CMOS, PBGA48, 7 X 11 MM, FBGA-48	Standard SRAM, 512KX8, 15ns, CMOS, PBGA48, 7 X 11 MM, FBGA-48	Standard SRAM, 512KX8, 20ns, CMOS, PBGA48, 7 X 11 MM, FBGA-48	Standard SRAM, 512KX8, 12ns, CMOS, PBGA48, 7 X 11 MM, FBGA-48
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]	ALSC [Alliance Semiconductor Corporation]
Parts packaging code	BGA	BGA	BGA	BGA	BGA
package instruction	TFBGA, BGA48,6X8,30	TFBGA, BGA48,6X8,30	TFBGA, BGA48,6X8,30	TFBGA, BGA48,6X8,30	TFBGA, BGA48,6X8,30
Contacts	48	48	48	48	48
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	15 ns	15 ns	15 ns	20 ns	12 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48	R-PBGA-B48
JESD-609 code	e0	e0	e0	e0	e0
length	11 mm	11 mm	11 mm	11 mm	11 mm
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	8	8	8	8	8
Number of functions	1	1	1	1	1
Number of terminals	48	48	48	48	48
word count	524288 words	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	70 °C	70 °C	70 °C	85 °C
organize	512KX8	512KX8	512KX8	512KX8	512KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA
Encapsulate equivalent code	BGA48,6X8,30	BGA48,6X8,30	BGA48,6X8,30	BGA48,6X8,30	BGA48,6X8,30
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	3.3 V	5 V	5 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Maximum standby current	0.02 A	0.02 A	0.02 A	0.02 A	0.02 A
Minimum standby current	4.5 V	3 V	4.5 V	4.5 V	3 V
Maximum slew rate	0.22 mA	0.11 mA	0.22 mA	0.18 mA	0.13 mA
Maximum supply voltage (Vsup)	5.5 V	3.6 V	5.5 V	5.5 V	3.6 V
Minimum supply voltage (Vsup)	4.5 V	3 V	4.5 V	4.5 V	3 V
Nominal supply voltage (Vsup)	5 V	3.3 V	5 V	5 V	3.3 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.75 mm	0.75 mm	0.75 mm	0.75 mm	0.75 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7 mm	7 mm	7 mm	7 mm	7 mm

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