|
ML2032IJ |
ML2031IJ |
Description |
DTMF Signaling Circuit, CMOS, CDIP8, |
DTMF Signaling Circuit, CMOS, CDIP8, |
Is it Rohs certified? |
incompatible |
incompatible |
Maker |
Qorvo |
Qorvo |
package instruction |
DIP, DIP8,.3 |
DIP, DIP8,.3 |
Reach Compliance Code |
unknown |
unknown |
JESD-30 code |
R-XDIP-T8 |
R-XDIP-T8 |
JESD-609 code |
e0 |
e0 |
Negative supply voltage rating |
-5 V |
-5 V |
Number of terminals |
8 |
8 |
Maximum operating temperature |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
Package body material |
CERAMIC |
CERAMIC |
encapsulated code |
DIP |
DIP |
Encapsulate equivalent code |
DIP8,.3 |
DIP8,.3 |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
IN-LINE |
IN-LINE |
power supply |
+-5 V |
+-5 V |
Certification status |
Not Qualified |
Not Qualified |
Maximum slew rate |
12 mA |
7.5 mA |
Nominal supply voltage |
5 V |
5 V |
surface mount |
NO |
NO |
technology |
CMOS |
CMOS |
Telecom integrated circuit types |
DTMF SIGNALING CIRCUIT |
DTMF SIGNALING CIRCUIT |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
Terminal pitch |
2.54 mm |
2.54 mm |
Terminal location |
DUAL |
DUAL |