EEWORLDEEWORLDEEWORLD

Part Number

Search

MM0-67204EV-40SB/SC

Description
FIFO, 4KX9, 40ns, Asynchronous, CMOS, DIE
Categorystorage    storage   
File Size219KB,15 Pages
ManufacturerAtmel (Microchip)
Download Datasheet Parametric Compare View All

MM0-67204EV-40SB/SC Overview

FIFO, 4KX9, 40ns, Asynchronous, CMOS, DIE

MM0-67204EV-40SB/SC Parametric

Parameter NameAttribute value
MakerAtmel (Microchip)
Parts packaging codeDIE
package instructionDIE
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time40 ns
period time50 ns
JESD-30 codeX-XUUC-N
memory density36864 bit
memory width9
Number of functions1
word count4096 words
character code4000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize4KX9
ExportableNO
Package body materialUNSPECIFIED
encapsulated codeDIE
Package shapeUNSPECIFIED
Package formUNCASED CHIP
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formNO LEAD
Terminal locationUPPER
M67204E
4 K

9 CMOS Parallel FIFO Rad Tolerant
Introduction
The M67204E implement a first-in first-out algorithm,
featuring asynchronous read/write operations. The FULL
and EMPTY flags prevent data overflow and underflow.
The Expansion logic allows unlimited expansion in word
size and depth with no timing penalties. Twin address
pointers automatically generate internal read and write
addresses, and no external address information are
required for the TEMIC FIFOs. Address pointers are
automatically incremented with the write pin and read
pin. The 9 bits wide data are used in data communications
applications where a parity bit for error checking is
necessary. The Retransmit pin resets the Read pointer to
zero without affecting the write pointer. This is very
useful for retransmitting data when an error is detected in
the system.
Using an array of eigh transistors (8 T) memory cell, the
M67204E combine an extremely low standby supply
current (typ = 1.0
µA)
with a fast access time at 40 ns
over the full temperature range. All versions offer battery
backup data retention capability with a typical power
consumption at less than 2
µW.
The M67204E is processed according to the methods of
the latest revision of the MIL STD 883 (class B or S), ESA
SCC 9000 and QML.
Features
D
D
D
D
First-in first-out dual port memory
4096
×
9 organisation
Fast access time: 40, 50 ns
Wide temperature range : – 55
°C
to + 125
°C
D
D
D
D
D
D
D
D
D
Fully expandable by word width or depth
Asynchronous read/write operations
Empty, full and half flags in single device mode
Retransmit capability
Bi-directional applications
Battery back-up operation 2 V data retention
TTL compatible
Single 5 V
±
10 % power supply
High performance SCMOS technology
Rev. G – June 5, 2000
1

MM0-67204EV-40SB/SC Related Products

MM0-67204EV-40SB/SC SMCP-67204EV-40SB/SC MMCP-67204EV-40SB/SC SM0-67204EV-40SB/SC
Description FIFO, 4KX9, 40ns, Asynchronous, CMOS, DIE FIFO, 4KX9, 40ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28 FIFO, 4KX9, 40ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28 FIFO, 4KX9, 40ns, Asynchronous, CMOS, DIE
Parts packaging code DIE DIP DIP DIE
package instruction DIE DIP, DIP, DIE,
Reach Compliance Code unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99
Maximum access time 40 ns 40 ns 40 ns 40 ns
period time 50 ns 50 ns 50 ns 50 ns
JESD-30 code X-XUUC-N R-CDIP-T28 R-CDIP-T28 X-XUUC-N
memory density 36864 bit 36864 bit 36864 bit 36864 bit
memory width 9 9 9 9
Number of functions 1 1 1 1
word count 4096 words 4096 words 4096 words 4096 words
character code 4000 4000 4000 4000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C
organize 4KX9 4KX9 4KX9 4KX9
Exportable NO NO NO NO
Package body material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED UNSPECIFIED
encapsulated code DIE DIP DIP DIE
Package shape UNSPECIFIED RECTANGULAR RECTANGULAR UNSPECIFIED
Package form UNCASED CHIP IN-LINE IN-LINE UNCASED CHIP
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount YES NO NO YES
technology CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY
Terminal form NO LEAD THROUGH-HOLE THROUGH-HOLE NO LEAD
Terminal location UPPER DUAL DUAL UPPER
Maker Atmel (Microchip) - Atmel (Microchip) Atmel (Microchip)

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号