MMCP-67204EV-40SB/SC datasheet, PDF

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MMCP-67204EV-40SB/SC: DescriptionFIFO, 4KX9, 40ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28; Categorystorage storage; File Size219KB，15 Pages; ManufacturerAtmel (Microchip)

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MMCP-67204EV-40SB/SC Overview

FIFO, 4KX9, 40ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28

MMCP-67204EV-40SB/SC Parametric

Parameter Name	Attribute value
Maker	Atmel (Microchip)
Parts packaging code	DIP
package instruction	DIP,
Contacts	28
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	40 ns
period time	50 ns
JESD-30 code	R-CDIP-T28
memory density	36864 bit
memory width	9
Number of functions	1
Number of terminals	28
word count	4096 words
character code	4000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	4KX9
Exportable	NO
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	5.84 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm

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M67204E

4 K

9 CMOS Parallel FIFO Rad Tolerant

Introduction

The M67204E implement a first-in first-out algorithm,

featuring asynchronous read/write operations. The FULL

and EMPTY flags prevent data overflow and underflow.

The Expansion logic allows unlimited expansion in word

size and depth with no timing penalties. Twin address

pointers automatically generate internal read and write

addresses, and no external address information are

required for the TEMIC FIFOs. Address pointers are

automatically incremented with the write pin and read

pin. The 9 bits wide data are used in data communications

applications where a parity bit for error checking is

necessary. The Retransmit pin resets the Read pointer to

zero without affecting the write pointer. This is very

useful for retransmitting data when an error is detected in

the system.

Using an array of eigh transistors (8 T) memory cell, the

M67204E combine an extremely low standby supply

current (typ = 1.0

µA)

with a fast access time at 40 ns

over the full temperature range. All versions offer battery

backup data retention capability with a typical power

consumption at less than 2

µW.

The M67204E is processed according to the methods of

the latest revision of the MIL STD 883 (class B or S), ESA

SCC 9000 and QML.

Features

First-in first-out dual port memory

4096

9 organisation

Fast access time: 40, 50 ns

Wide temperature range : – 55

°C

to + 125

°C

Fully expandable by word width or depth

Asynchronous read/write operations

Empty, full and half flags in single device mode

Retransmit capability

Bi-directional applications

Battery back-up operation 2 V data retention

TTL compatible

Single 5 V

10 % power supply

High performance SCMOS technology

Rev. G – June 5, 2000

MMCP-67204EV-40SB/SC Related Products

	MMCP-67204EV-40SB/SC	SMCP-67204EV-40SB/SC	MM0-67204EV-40SB/SC	SM0-67204EV-40SB/SC
Description	FIFO, 4KX9, 40ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28	FIFO, 4KX9, 40ns, Asynchronous, CMOS, CDIP28, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28	FIFO, 4KX9, 40ns, Asynchronous, CMOS, DIE	FIFO, 4KX9, 40ns, Asynchronous, CMOS, DIE
Parts packaging code	DIP	DIP	DIE	DIE
package instruction	DIP,	DIP,	DIE	DIE,
Reach Compliance Code	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99
Maximum access time	40 ns	40 ns	40 ns	40 ns
period time	50 ns	50 ns	50 ns	50 ns
JESD-30 code	R-CDIP-T28	R-CDIP-T28	X-XUUC-N	X-XUUC-N
memory density	36864 bit	36864 bit	36864 bit	36864 bit
memory width	9	9	9	9
Number of functions	1	1	1	1
word count	4096 words	4096 words	4096 words	4096 words
character code	4000	4000	4000	4000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C
organize	4KX9	4KX9	4KX9	4KX9
Exportable	NO	NO	NO	NO
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIP	DIP	DIE	DIE
Package shape	RECTANGULAR	RECTANGULAR	UNSPECIFIED	UNSPECIFIED
Package form	IN-LINE	IN-LINE	UNCASED CHIP	UNCASED CHIP
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	NO LEAD
Terminal location	DUAL	DUAL	UPPER	UPPER
Maker	Atmel (Microchip)	-	Atmel (Microchip)	Atmel (Microchip)

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