M395T5750GZ4-CE63 datasheet, PDF

M395T5750GZ4-CE63: DescriptionDDR DRAM Module, 256MX72, CMOS, HALOGEN FREE AND ROHS COMPLIANT, DIMM-240; Categorystorage storage; File Size653KB，33 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/; Environmental Compliance

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M395T5750GZ4-CE63 Overview

DDR DRAM Module, 256MX72, CMOS, HALOGEN FREE AND ROHS COMPLIANT, DIMM-240

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SAMSUNG
Parts packaging code	DIMM
package instruction	DIMM, DIMM240,40
Contacts	240
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	DUAL BANK PAGE BURST
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	333 MHz
I/O type	COMMON
JESD-30 code	R-XDMA-N240
memory density	19327352832 bit
Memory IC Type	DDR DRAM MODULE
memory width	72
Number of functions	1
Number of ports	1
Number of terminals	240
word count	268435456 words
character code	256000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature
organize	256MX72
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM240,40
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.5,1.8 V
Certification status	Not Qualified
refresh cycle	8192
self refresh	YES
Maximum slew rate	5.35 mA
Maximum supply voltage (Vsup)	1.575 V
Minimum supply voltage (Vsup)	1.455 V
Nominal supply voltage (Vsup)	1.5 V
surface mount	NO
technology	CMOS
Temperature level	OTHER
Terminal form	NO LEAD
Terminal pitch	1 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

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