ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP24
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Fairchild |
package instruction | DIP, DIP24,.3 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum analog input voltage | 5 V |
Minimum analog input voltage | |
Converter type | ADC, FLASH METHOD |
JESD-30 code | R-PDIP-T24 |
JESD-609 code | e0 |
Maximum linear error (EL) | 0.3906% |
Number of analog input channels | 1 |
Number of digits | 8 |
Number of functions | 1 |
Number of terminals | 24 |
Maximum operating temperature | 75 °C |
Minimum operating temperature | -20 °C |
Output bit code | BINARY |
Output format | PARALLEL, 8 BITS |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP24,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Sampling rate | 40 MHz |
Sample and hold/Track and hold | TRACK |
Maximum slew rate | 40 mA |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL EXTENDED |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
TMC1175N2C40 | TMC1175N2C20 | TMC1175N2C50 | TMC1175N2C30 | TMC1175R3C30 | |
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Description | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP24 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP24 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP24 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP24 | ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PQCC28 |
package instruction | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, | DIP, DIP24,.3 | QCCJ, LDCC28,.5SQ |
Reach Compliance Code | compliant | compliant | unknown | compliant | compliant |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum analog input voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
Converter type | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD |
JESD-30 code | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | S-PQCC-J28 |
Maximum linear error (EL) | 0.3906% | 0.3906% | 0.3906% | 0.3906% | 0.3906% |
Number of analog input channels | 1 | 1 | 1 | 1 | 1 |
Number of digits | 8 | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 24 | 24 | 24 | 24 | 28 |
Maximum operating temperature | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C |
Minimum operating temperature | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
Output bit code | BINARY | BINARY | BINARY | BINARY | BINARY |
Output format | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | DIP | DIP | QCCJ |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Sampling rate | 40 MHz | 20 MHz | 50 MHz | 30 MHz | 30 MHz |
Sample and hold/Track and hold | TRACK | TRACK | TRACK | TRACK | TRACK |
Maximum slew rate | 40 mA | 30 mA | 48 mA | 35 mA | 35 mA |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND |
Terminal location | DUAL | DUAL | DUAL | DUAL | QUAD |
Is it Rohs certified? | incompatible | incompatible | - | incompatible | incompatible |
Maker | Fairchild | - | Fairchild | Fairchild | Fairchild |
JESD-609 code | e0 | e0 | - | e0 | e0 |
Encapsulate equivalent code | DIP24,.3 | DIP24,.3 | - | DIP24,.3 | LDCC28,.5SQ |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V | - | 5 V | 5 V |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal pitch | 2.54 mm | 2.54 mm | - | 2.54 mm | 1.27 mm |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |