32KX8 STANDARD SRAM, 70ns, PDSO28, 8 X 13.40 MM, LEAD FREE, TSOP1-28
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | Rochester Electronics |
| Parts packaging code | TSOP |
| package instruction | 8 X 13.40 MM, LEAD FREE, TSOP1-28 |
| Contacts | 28 |
| Reach Compliance Code | unknown |
| Maximum access time | 70 ns |
| JESD-30 code | R-PDSO-G28 |
| JESD-609 code | e3 |
| length | 11.8 mm |
| memory density | 262144 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 8 |
| Humidity sensitivity level | NOT SPECIFIED |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 32768 words |
| character code | 32000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -40 °C |
| organize | 32KX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSOP1 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 |
| Certification status | COMMERCIAL |
| Maximum seat height | 1.2 mm |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 2.7 V |
| Nominal supply voltage (Vsup) | 3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | AUTOMOTIVE |
| Terminal surface | MATTE TIN |
| Terminal form | GULL WING |
| Terminal pitch | 0.55 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 20 |
| width | 8 mm |
| CY62256VNLL-70ZXE | CY62256VNLL-70SNXI | CY62256VNLL-70ZXI | CY62256VNLL-70ZXC | CY62256VNLL-70ZRXI | CY62256VNLL-70SNXE | |
|---|---|---|---|---|---|---|
| Description | 32KX8 STANDARD SRAM, 70ns, PDSO28, 8 X 13.40 MM, LEAD FREE, TSOP1-28 | 32KX8 STANDARD SRAM, 70ns, PDSO28, 0.300 INCH, LEAD FREE, SOIC-28 | 32KX8 STANDARD SRAM, 70ns, PDSO28, 8 X 13.40 MM, LEAD FREE, TSOP1-28 | 32KX8 STANDARD SRAM, 70ns, PDSO28, 8 X 13.40 MM, LEAD FREE, TSOP1-28 | 32KX8 STANDARD SRAM, 70ns, PDSO28, 8 X 13.40 MM, LEAD FREE, REVERSE, TSOP1-28 | 32KX8 STANDARD SRAM, 70ns, PDSO28, 0.300 INCH, LEAD FREE, SOIC-28 |
| Is it lead-free? | Lead free | Lead free | Lead free | Lead free | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to |
| Maker | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| Parts packaging code | TSOP | SOIC | TSOP | TSOP | TSOP | SOIC |
| package instruction | 8 X 13.40 MM, LEAD FREE, TSOP1-28 | 0.300 INCH, LEAD FREE, SOIC-28 | 8 X 13.40 MM, LEAD FREE, TSOP1-28 | 8 X 13.40 MM, LEAD FREE, TSOP1-28 | 8 X 13.40 MM, LEAD FREE, REVERSE, TSOP1-28 | 0.300 INCH, LEAD FREE, SOIC-28 |
| Contacts | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| Maximum access time | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns | 70 ns |
| JESD-30 code | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 |
| JESD-609 code | e3 | e4 | e3 | e3 | e3 | e4 |
| length | 11.8 mm | 17.9324 mm | 11.8 mm | 11.8 mm | 11.8 mm | 17.9324 mm |
| memory density | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 |
| Humidity sensitivity level | NOT SPECIFIED | 3 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 3 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 28 | 28 | 28 | 28 |
| word count | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| character code | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 85 °C | 85 °C | 70 °C | 85 °C | 125 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C |
| organize | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSOP1 | SOP | TSOP1 | TSOP1 | TSOP1-R | SOP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 | 260 |
| Certification status | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Maximum seat height | 1.2 mm | 2.794 mm | 1.2 mm | 1.2 mm | 1.2 mm | 2.794 mm |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| Nominal supply voltage (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| surface mount | YES | YES | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | AUTOMOTIVE |
| Terminal surface | MATTE TIN | NICKEL PALLADIUM GOLD | MATTE TIN | MATTE TIN | MATTE TIN | NICKEL PALLADIUM GOLD |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.55 mm | 1.27 mm | 0.55 mm | 0.55 mm | 0.55 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 20 | 20 | 20 | 20 | 20 | 20 |
| width | 8 mm | 7.5057 mm | 8 mm | 8 mm | 8 mm | 7.5057 mm |
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