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USC68HC551CPD

Description
Serial I/O Controller, 1 Channel(s), 0.125MBps, CMOS, PDIP24, PLASTIC, DIP-24
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size284KB,4 Pages
ManufacturerUniversal Semiconductor Inc
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USC68HC551CPD Overview

Serial I/O Controller, 1 Channel(s), 0.125MBps, CMOS, PDIP24, PLASTIC, DIP-24

USC68HC551CPD Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerUniversal Semiconductor Inc
Parts packaging codeDIP
package instructionDIP, DIP24,.3
Contacts24
Reach Compliance Codeunknown
Address bus width
boundary scanNO
Bus compatibility6800; 68000
maximum clock frequency2.45 MHz
letter of agreementASYNC, BIT
Maximum data transfer rate0.125 MBps
External data bus width8
JESD-30 codeR-PDIP-T24
JESD-609 codee0
low power modeNO
Number of serial I/Os1
Number of terminals24
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum supply voltage5.25 V
Minimum supply voltage4.75 V
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
uPs/uCs/peripheral integrated circuit typeSERIAL IO/COMMUNICATION CONTROLLER, SERIAL

USC68HC551CPD Preview

This Material Copyrighted By Its Respective Manufacturer
This Material Copyrighted By Its Respective Manufacturer
This Material Copyrighted By Its Respective Manufacturer
This Material Copyrighted By Its Respective Manufacturer

USC68HC551CPD Related Products

USC68HC551CPD USC68HC551CCD
Description Serial I/O Controller, 1 Channel(s), 0.125MBps, CMOS, PDIP24, PLASTIC, DIP-24 Serial I/O Controller, 1 Channel(s), 0.125MBps, CMOS, CDIP24, CERAMIC, DIP-24
Is it Rohs certified? incompatible incompatible
Maker Universal Semiconductor Inc Universal Semiconductor Inc
Parts packaging code DIP DIP
package instruction DIP, DIP24,.3 DIP, DIP24,.3
Contacts 24 24
Reach Compliance Code unknown unknown
boundary scan NO NO
Bus compatibility 6800; 68000 6800; 68000
maximum clock frequency 2.45 MHz 2.45 MHz
letter of agreement ASYNC, BIT ASYNC, BIT
Maximum data transfer rate 0.125 MBps 0.125 MBps
External data bus width 8 8
JESD-30 code R-PDIP-T24 R-GDIP-T24
JESD-609 code e0 e0
low power mode NO NO
Number of serial I/Os 1 1
Number of terminals 24 24
Maximum operating temperature 70 °C 70 °C
Package body material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
encapsulated code DIP DIP
Encapsulate equivalent code DIP24,.3 DIP24,.3
Package shape RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V
Certification status Not Qualified Not Qualified
Maximum supply voltage 5.25 V 5.25 V
Minimum supply voltage 4.75 V 4.75 V
Nominal supply voltage 5 V 5 V
surface mount NO NO
technology CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm
Terminal location DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
uPs/uCs/peripheral integrated circuit type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
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