Serial I/O Controller, 1 Channel(s), 0.125MBps, CMOS, PDIP24, PLASTIC, DIP-24
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Universal Semiconductor Inc |
Parts packaging code | DIP |
package instruction | DIP, DIP24,.3 |
Contacts | 24 |
Reach Compliance Code | unknown |
Address bus width | |
boundary scan | NO |
Bus compatibility | 6800; 68000 |
maximum clock frequency | 2.45 MHz |
letter of agreement | ASYNC, BIT |
Maximum data transfer rate | 0.125 MBps |
External data bus width | 8 |
JESD-30 code | R-PDIP-T24 |
JESD-609 code | e0 |
low power mode | NO |
Number of serial I/Os | 1 |
Number of terminals | 24 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP24,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum supply voltage | 5.25 V |
Minimum supply voltage | 4.75 V |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
uPs/uCs/peripheral integrated circuit type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
USC68HC551CPD | USC68HC551CCD | |
---|---|---|
Description | Serial I/O Controller, 1 Channel(s), 0.125MBps, CMOS, PDIP24, PLASTIC, DIP-24 | Serial I/O Controller, 1 Channel(s), 0.125MBps, CMOS, CDIP24, CERAMIC, DIP-24 |
Is it Rohs certified? | incompatible | incompatible |
Maker | Universal Semiconductor Inc | Universal Semiconductor Inc |
Parts packaging code | DIP | DIP |
package instruction | DIP, DIP24,.3 | DIP, DIP24,.3 |
Contacts | 24 | 24 |
Reach Compliance Code | unknown | unknown |
boundary scan | NO | NO |
Bus compatibility | 6800; 68000 | 6800; 68000 |
maximum clock frequency | 2.45 MHz | 2.45 MHz |
letter of agreement | ASYNC, BIT | ASYNC, BIT |
Maximum data transfer rate | 0.125 MBps | 0.125 MBps |
External data bus width | 8 | 8 |
JESD-30 code | R-PDIP-T24 | R-GDIP-T24 |
JESD-609 code | e0 | e0 |
low power mode | NO | NO |
Number of serial I/Os | 1 | 1 |
Number of terminals | 24 | 24 |
Maximum operating temperature | 70 °C | 70 °C |
Package body material | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
encapsulated code | DIP | DIP |
Encapsulate equivalent code | DIP24,.3 | DIP24,.3 |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED |
power supply | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified |
Maximum supply voltage | 5.25 V | 5.25 V |
Minimum supply voltage | 4.75 V | 4.75 V |
Nominal supply voltage | 5 V | 5 V |
surface mount | NO | NO |
technology | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED |
uPs/uCs/peripheral integrated circuit type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |